I. Costa

New Stress Activation Method for Kerfless Silicon Wafering Using Ag/Al and Epoxy Stress-Inducing Layers

The SLIM-cut technique provides a way to obtain thin silicon foils without a standard sawing step, thus avoiding kerf losses. This process consists of three steps: depositing a stress-inducing layer on top of the silicon surface; stress activation by heating and cooling, resulting in crack propagation in the silicon and detachment of a thin silicon layer; and a chemical cleaning to remove the stress-inducing layer. This paper describes a new stress activation method using Ag/Al and epoxy stress-inducing layers. The crack propagation is controlled along the sample length in order to avoid unwanted additional crack formation and interaction with other crack fronts. Silicon foils with thickness ranging between 50 and 130 μm were obtained with effective lifetimes between 1 and 81 μs.

Electric molten zone crystallization of silicon wafers

A new method for molten zone crystallization is presented. The method is based on the formation of a molten capillary by applying an electric current. Since the power is delivered directly to the liquid, the technique has the potential for low energy budget. On the other hand, being a floating molten zone method, the liquid silicon never contacts foreign materials and therefore is essentially contamination free. Experimental results show that the crystallized samples feature relatively low minority carrier lifetimes which are correlated to relatively high dislocation densities, associated with the sample temperature profile.

First solar cells on silicon wafers doped using sprayed boric acid

A new method for boron bulk doping of silicon ribbons is developed. The method is based on the spraying of the ribbons with a boric acid solution and is particularly suited for silicon ribbons that require a zone-melting recrystallization step. To analyse the quality of the material thus obtained, multicrystalline silicon samples doped with this doping process were used as substrate for solar cells and compared with solar cells made on commercial multicrystalline silicon wafers. The values obtained for the diffusion length and the IV curve parameters show that the method of doping with the boric acid solution is suitable to produce p-doped silicon ribbons for solar cell applications.