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Ichirou Ogura

DIC Corporation

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Publication

Featured researches published by Ichirou Ogura.

Archive | 2006

Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin

Ichirou Ogura; Yoshiyuki Takahashi; Yutaka Sato

Archive | 2009

Process for production of phosphorus-atom-containing phenol, novel phosphorus-atom-containing phenol, curable resin composition, cured product thereof, printed circuit board, and semiconductor sealing material

Koji Hayashi; Yoshiyuki Takahashi; Ichirou Ogura

Archive | 2010

Resin composition for fiber-reinforced composite material, cured product thereof, fiber-reinforced composite material, molding of fiber-reinforced resin, and process for production thereof

Atsuko Kobayashi; Ichirou Ogura

Archive | 2009

Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin

Ichirou Ogura; Kunihiro Morinaga; Kazuo Arita; Yutaka Sato

Archive | 2009

Curable resin composition and cured product thereof, printed circuit board, and epoxy resin and method for producing same

Yutaka Satou; Kazuo Arita; Ichirou Ogura

Archive | 2009

Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin

Ichirou Ogura; Yoshiyuki Takahashi; Yutaka Sato

Archive | 2006

METHOD OF PRODUCING PHENOL RESIN AND METHOD OF PRODUCING EPOXY RESIN

Kazuo Arita; Ichirou Ogura; Kunihiro Morinaga

Archive | 2011

Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material

Ichirou Ogura; Yousuke Hirota; Yoshiyuki Takahashi; Norio Nagae; Nobuya Nakamura

Archive | 2009

METHOD FOR PRODUCING PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, NOVEL PHOSPHORUS-CONTAINING PHENOL, CURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, PRINTED WIRING BOARD, AND SEMICONDUCTOR SEALING MATERIAL

Koji Hayashi; Yoshiyuki Takahashi; Ichirou Ogura

Archive | 2006

EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, NOVEL EPOXY RESIN, NOVEL PHENOL RESIN AND SEMICONDUCTOR-ENCAPSULATING MATERIAL

Kazuo Arita; Ichirou Ogura; Kunihiro Morinaga

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Collaboration

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Kazuo Arita

DIC Corporation

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Yoshiyuki Takahashi

DIC Corporation

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Kunihiro Morinaga

DIC Corporation

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Yutaka Sato

DIC Corporation

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Koji Hayashi

DIC Corporation

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Yutaka Satou

DIC Corporation

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Atsuko Kobayashi

DIC Corporation

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Nobuya Nakamura

DIC Corporation

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Norio Nagae

DIC Corporation

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Yousuke Hirota

DIC Corporation

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