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Kunihiro Morinaga

DIC Corporation

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Publication

Featured researches published by Kunihiro Morinaga.

Archive | 2006

Epoxy resin composition, cured product thereof, novel epoxy resin, production method thereof, and novel phenol resin

Kazuo Arita; Kunihiro Morinaga; Ichiro Ogura; Yasushi Sato; 泰 佐藤; 一郎 小椋; 和郎 有田; 邦裕 森永

Archive | 2002

Epoxy resin composition and its molded and cured product

Kunihiro Morinaga; Ichiro Ogura; 小椋 一郎; 森永 邦裕

Archive | 2009

Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin

Ichirou Ogura; Kunihiro Morinaga; Kazuo Arita; Yutaka Sato

Archive | 2006

METHOD OF PRODUCING PHENOL RESIN AND METHOD OF PRODUCING EPOXY RESIN

Kazuo Arita; Ichirou Ogura; Kunihiro Morinaga

Archive | 2011

Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin

Ichiro Ogura; Yoshiyuki Takahashi; Kazuo Arita; Kunihiro Morinaga; Yutaka Satou

Archive | 2012

Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film

Kan Takeuchi; Etsuko Suzuki; Kunihiro Morinaga; Kazuo Arita

Archive | 2005

Epoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel epoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin

Ichiro Ogura; Yoshiyuki Takahashi; Kazuo Arita; Kunihiro Morinaga; Yutaka Satou

Archive | 2004

ONE PACK-TYPE EPOXY RESIN COMPOSITION AND ITS HARDENED ARTICLE

Kunihiro Morinaga; Ichiro Ogura; 一郎 小椋; 邦裕 森永

Archive | 2014

EPOXY RESIN COMPOSITION, CURED PRODUCT, HEAT RADIATING MATERIAL, AND ELECTRONIC MEMBER

Yasuyo Yoshimoto; Atsushi Oshio; Kunihiro Morinaga; Hiroshi Kinoshita; Daisuke Ito

Archive | 2006

EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, NOVEL EPOXY RESIN, NOVEL PHENOL RESIN AND SEMICONDUCTOR-ENCAPSULATING MATERIAL

Kazuo Arita; Ichirou Ogura; Kunihiro Morinaga

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Collaboration

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Ichiro Ogura

DIC Corporation

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Kazuo Arita

DIC Corporation

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Ichirou Ogura

DIC Corporation

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Hiroshi Kinoshita

DIC Corporation

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Yasuyo Yoshimoto

DIC Corporation

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Yoshiyuki Takahashi

DIC Corporation

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Yutaka Satou

DIC Corporation

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Atsushi Oshio

DIC Corporation

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Daisuke Ito

Saitama Medical University

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Etsuko Suzuki

DIC Corporation

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