Ikeda Ken-ichi

Instantaneous creep in face-centered cubic metals at ultralow strain rates by a high-resolution strain measurement

Instantaneous creep in face-centered cubic metals, 5N Al (99.999%), 2N Al (99%) and 4N Cu (99.99%) with different grain sizes, was firstly investigated by sudden stress-change experiments at ultralow strain rates

METAL MOLDED PRODUCT AND METAL POWDER FOR METAL MOLDED PRODUCT

\dot \varepsilon

Microstructural Analysis of Polycrystalline Silicon Thin Films Formation Behavior during Aluminum Induced Crystallization

⩽ 10−10 s−1 and temperature T < 0.32 Tm. The experimental results indicate that the observed instantaneous creep is strongly dependent on grain size, the concentration of impurity, and stacking fault energy. Creep in high-purity aluminum, 5N Al, with a very large grain size, dg > 1600 μm, shows non-viscous behavior, and is controlled by the recovery of dislocations in the boundary of dislocation cells. On the other hand, for 5N Al with a small grain size, dg=30 μm, and low-purity aluminum, 2N Al, with dg= 25 μm, creep shows viscous behavior and may be related to ‘low temperature grain boundary sliding’. For high-purity copper, 4N Cu, with dg= 40 μm and lower stacking fault energy, creep shows a non-viscous behavior, and is controlled by the recovery process of dislocations. For all of the samples, creep shows anelastic behavior.