Ilia Polian

A Family of Logical Fault Models for Reversible Circuits

Reversibility is of interest in achieving extremely low power dissipation; it is also an inherent design requirement of quantum computation. Logical fault models for conventional circuits such as stuck-at models are not wellsuited to quantum circuits. We derive a family of logical fault models for reversible circuits composed of k- CNOT (k-input controlled-NOT) gates and implementable by many technologies. The models are extensions of the previously proposed single missing-gate fault (MGF) model, and include multiple and partial MGFs. We study the basic detection requirements of the new fault types and derive bounds on the size of their test sets. We also present optimal test sets computed via integer linear programming for various benchmark circuits. These results indicate that, although the test sets are generally very small, partial MGFs may need significantly larger test sets than single MGFs.

X-masking during logic BIST and its impact on defect coverage

We present a technique for making a circuit ready for logic built-in self test by masking unknown values at its outputs. In order to keep the silicon area cost low, some known bits in output responses are also allowed to be masked. These bits are selected based on a stuck-at n-detection based metric, such that the impact of masking on the defect coverage is minimal. An analysis based on a probabilistic model for resistive short defects indicates that the coverage loss for unmodeled defects is negligible for relatively low values of n.

Simulating resistive bridging and stuck-at faults

We present a simulator for resistive bridging and stuck-at faults. In contrast to earlier work, it is based on electrical equations rather than table look-up, thus exposing more flexibility. For the first time, simulation of sequential circuits is dealt with; reciprocal action of fault effects in current time frame and earlier time frames is elaborated on for different bridge resistances. Experimental results are given for resistive bridging and stuck-at faults in combinational and sequential circuits. Different definitions of fault coverage are listed and quantitative results with respect to all these definitions are given for the first time.The authors present a simulator for resistive-bridging and stuck-at faults. In contrast to earlier work, it is based on electrical equations rather than table look up, thus, exposing more flexibility. For the first time, simulation of sequential circuits is dealt with; interaction of fault effects in current time frame and earlier time frames is elaborated on for different bridge resistances. Experimental results are given for resistive-bridging and stuck-at faults in combinational and sequential circuits. Different definitions of fault coverage are listed, and quantitative results with respect to all these definitions are given for the first time

Analysis and optimization of fault-tolerant embedded systems with hardened processors

In this paper we propose an approach to the design optimization of fault-tolerant hard real-time embedded systems, which combines hardware and software fault tolerance techniques. We trade-off between selective hardening in hardware and process re-execution in software to provide the required levels of fault tolerance against transient faults with the lowest-possible system costs. We propose a system failure probability (SFP) analysis that connects the hardening level with the maximum number of re-executions in software. We present design optimization heuristics, to select the fault-tolerant architecture and decide process mapping such that the system cost is minimized, deadlines are satisfied, and the reliability requirements are fulfilled.

Simulating Resistive-Bridging and Stuck-At Faults

The authors present a simulator for resistive-bridging and stuck-at faults. In contrast to earlier work, it is based on electrical equations rather than table look up, thus, exposing more flexibility. For the first time, simulation of sequential circuits is dealt with; interaction of fault effects in current time frame and earlier time frames is elaborated on for different bridge resistances. Experimental results are given for resistive-bridging and stuck-at faults in combinational and sequential circuits. Different definitions of fault coverage are listed, and quantitative results with respect to all these definitions are given for the first time

Thread-Parallel Integrated Test Pattern Generator Utilizing Satisfiability Analysis

Efficient utilization of the inherent parallelism of multi-core architectures is a grand challenge in the field of electronic design automation (EDA). One EDA algorithm associated with a high computational cost is automatic test pattern generation (ATPG). We present the ATPG tool TIGUAN based on a thread-parallel SAT solver. Due to a tight integration of the SAT engine into the ATPG algorithm and a carefully chosen mix of various optimization techniques, multi-million-gate industrial circuits are handled without aborts. TIGUAN supports both conventional single-stuck-at faults and sophisticated conditional multiple stuck-at faults which allows to generate patterns for non-standard fault models. We demonstrate how TIGUAN can be combined with conventional structural ATPG to extract full benefit of the intrinsic strengths of both approaches.

Power Droop Testing

Circuit activity is a function of input patterns. When circuit activity changes abruptly, it can cause sudden drop or rise in power supply voltage. This change is known as power droop and is an instance of power supply noise. Although power droop may cause an IC to fail, such failures cannot currently be screened during testing as it is not covered by conventional fault models. In this paper we present a technique for screening such failures. We propose a heuristic method to generate test sequences which create worst-case power drop by accumulating the high-frequency and low-frequency effects. The generated patterns need to be sequential even for scan designs. We employ a dynamically constrained version of the classical D-algorithm for test generation, i.e., the algorithm generates new constraints on-the-fly depending on previous assignments. The obtained patterns can be used for manufacturing testing as well as for early silicon validation. A prototype ATPG is implemented to demonstrate the feasibility of the approach and test sequences are generated for ISCAS circuits.

A Simulator of Small-Delay Faults Caused by Resistive-Open Defects

We present a simulator which determines the coverage of small-delay faults, i.e., delay faults with a size below one clock cycle, caused by resistive-open defects. These defects are likely to escape detection by stuck-at or transition fault patterns. For the first time, we couple the calculation of the critical size of a small-delay fault with the computation of the resistance range of the corresponding resistive-open defect for which this size is exceeded. By doing so, we are able to extend probabilistic fault coverage metrics initially developed for static resistive bridging faults to small-delay defects.

Functional Constraints vs. Test Compression in Scan-Based Delay Testing

We present an approach to prevent over testing in scan-based delay test. The test data is transformed with respect to functional constraints while simultaneously keeping as many positions as possible unspecified in order to facilitate test compression. The method is independent of the employed delay fault model, ATPG algorithm and test compression technique, and it is easy to integrate into an existing flow. Experimental results emphasize the severity of over testing in scan-based delay test. Influence of different functional constraints on the amount of the required test data and the compression efficiency is investigated. To the best of our knowledge, this is the first systematic study on the relationship between over testing prevention and test compression

Automatic Test Pattern Generation for Interconnect Open Defects

We present a fully automated flow to generate test patterns for interconnect open defects. Both inter-layer opens (open- via defects) and arbitrary intra-layer opens can be targeted. An aggressor-victim model used in industry is employed to describe the electrical behavior of the open defect. The flow is implemented using standard commercial tools for parameter extraction (PEX) and test generation (ATPG). A highly optimized branch-and bound algorithm to determine the values to be assigned to the aggressor lines is used to reduce both the ATPG efforts and the number of aborts. The resulting test sets are smaller and achieve a higher defect coverage than stuck-at n-detection test sets, and are robust against process variations.