Ilja Belov
Jönköping University
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Featured researches published by Ilja Belov.
Transactions of The Institute of Metal Finishing | 2007
Peter Leisner; Patrick Møller; Mikael Fredenberg; Ilja Belov
Abstract Based on demands for modern printed circuit board (pcb) manufacturing, the copper electroplating process is discussed. Electroplating from an additive free solution using low frequency pulse reversal plating with superimposed cathodic pulsation is suggested, which meets the demands for precise dimensions, high ductility and conductivity, low costs and environmental friendliness.
International Journal of Clothing Science and Technology | 2007
Michel Chedid; Ilja Belov; Peter Leisner
Purpose – The paper seeks, by means of measurement and modelling, to evaluate frequency dependent per‐unit‐length parameters of conductive textile transmission line (CTTL) for wearable applications and to study deterioration of these parameters when CTTL is subjected to washing.Design/methodology/approach – The studied transmission line is made of Nickel/Copper (Ni/Cu) plated polyester ripstop fabric and is subjected to standard 60°C cycle in a commercial off‐the‐shelf washing machine. The per‐unit‐length parameters (resistance and inductance) and characteristic impedance of the line are extracted from measurements before and after washing. Using the measurement data an equivalent circuit is created to model the degradation of the line. The circuit is then integrated in a three‐dimensional transmission line matrix (TLM) model of the transmission line.Findings – Both an electrical equivalent circuit and a TLM model are developed describing the degradation of the conductive textile when washed. A severe det...
international conference on thermal mechanial and multi physics simulation and experiments in micro electronics and micro systems | 2007
Ilja Belov; Mats Lindgren; Peter Leisner; Fredrik Bergner; Robin Bornoff
A CFD-aided reflow oven profile prediction algorithm has been developed and applied to modelling of preheating of a PCB with non-uniform distribution of component thermal mass in a forced air convection solder reflow oven. The iterative algorithm combines an analytic approach with CFD modelling. It requires an experimentally validated CFD model of the solder reflow oven and a CFD model of the PCB as main inputs. Results of computational experiments have been presented to reveal good agreement between predicted PCB profiles and corresponding CFD calculations. Application guidelines contained in the description of the algorithm will assist potential users both during the virtual prototyping phase of a PCB including designing for assembly and in the phase of reflow oven profiling.
Transactions of The Institute of Metal Finishing | 2009
Peter Leisner; Ilja Belov
Abstract It has for a long time been known that crack free chromium coatings can be obtained by pulse reversal plating, but it has only much later been understood that reoxidation of hydrogen from the surface during the anodic periods is essential for obtaining crack free deposits. In this paper, it is shown that a specific anodic charge depending on the charge of the previous cathodic pulse is needed to obtain a crack free coating and that residual stress in the coating will be less at more frequent current reversals. Furthermore, too large an anodic charge will result in redissolution of chromium and thereby decrease the current efficiency.
international conference on thermal mechanial and multi physics simulation and experiments in micro electronics and micro systems | 2008
Ilja Belov; Jan Ryden; Joakim Lindeblom; Yafan Zhang; Torgny Hansson; Fredrik Bergner; Peter Leisner
A CFD modelling methodology including experimental validation has been developed and applied for investigation of anti-moisture measures in a non- hermetic electronics enclosure containing a number of printed circuit boards, and placed in a severe storage environment. In the climatic test the temperature and the relative humidity have been varried from +33degC to +71degC and from 14% to 80%, respectively. Enclosure heater solutions have been parametrically studied by simulation. A heating strategy involving various power levels has been determined, which is just sufficient to maintain the internal relative humidity below 60%, thereby reducing the risk for dew formation on the electronics assembly.
Transactions of The Institute of Metal Finishing | 2014
Peter Leisner; Caterina Zanella; Ilja Belov; Curt Edström; Hui Wang
Abstract This paper discusses how anodic pulses and periodic current reversion influence electrodeposition. Depending on the involved metal and electrolyte, very different effects can be observed and taken advantage of. The Wagner number, Wa, describing the current distribution is shown to be useful for predicting the throwing power at low frequencies of current reversion, even in complex electrochemical systems, but is less useful at higher frequencies. Passivation can occur due to oxide formation, super-saturation of metal salts or depletion of complexing agents at the electrode surface. Furthermore, dissolution and desorption processes in the anodic period can have strong influence on the succeeding cathodic electrocrystallisation affecting preferred crystal orientation, intrinsic stress and current efficiency. A literature survey is combined with experiments from silver plating from a cyanide bath.
Engineering Computations | 2014
Jonas Johansson; Ilja Belov; Erland Johnson; Peter Leisner
Purpose – The purpose of this paper is to introduce a novel computational method to evaluate damage accumulation in a solder joint of an electronic package, when exposed to operating temperature en ...
Transactions of The Institute of Metal Finishing | 2010
Peter Leisner; Mikael Fredenberg; Ilja Belov
Abstract This paper describes how copper plating is influenced by modulated current. By unipolar pulse plating smooth, compact and fine grained structures can be obtained, but the macro throwing power is worse than by direct current plating. The best throwing power is obtained by pulse reverse plating. In additive containing solutions, excellent throwing power has been obtained at the following parameters: T c/T a=20, i a/i c=1–3·5 and Q a/Q c<0·2. Without additives the surface becomes less smooth. Finally, superimposed pulse reverse plating has the possibility to combine the advantages of uni- and bipolar pulse plating in an additive free process.
International Journal of Emerging Electric Power Systems | 2006
Vladimir Belov; Alexey Shamaev; Peter Leisner; Alf Johansson; Bengt Magnhagen; Ilja Belov
A novel simulation-based spectral technique for power quality and electromagnetic compatibility (EMC) design of an independent electrical power system (EPS) has been proposed. Power filter optimization problem has been formulated to provide full solution of the electric power quality and conducted EMI problems in the EPS. The spectral technique has been implemented within a CAD tool. An example of power quality and EMC design has been provided for an independent EPS where an AC power source generates a power, which is comparable to the consumed power, and an additional power filter is calculated for an electronic product including a switch-mode power supply. Current and voltage spectra calculations have been verified with a block-oriented simulation program Simulink. Numerical experiments revealed a number of important features of the proposed spectral technique.
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the | 2004
Ilja Belov; Helena Wingbrant; Anita-Lloyd Spetz; Hans Sundgren; Bo Thunér; Henrick Svenningstorp; Peter Leisner
Different block and tube mounting alternatives for SiC-based gas sensors were studied by means of temperature measurements and simulation of heat transfer and gas flow for steady state conditions. The most preferable tube mounting design was determined. Simulation-based guidelines were developed for designing tube-mounted gas sensors in the exhaust pipes of diesel and petrol engines, taking into account thermal constraints and flow conditions.