Iljo Kwak

Atomic Layer Deposition of Al2O3 on WSe2 Functionalized by Titanyl Phthalocyanine

To deposit an ultrathin dielectric onto WSe2, monolayer titanyl phthalocyanine (TiOPc) is deposited by molecular beam epitaxy as a seed layer for atomic layer deposition (ALD) of Al2O3 on WSe2. TiOPc molecules are arranged in a flat monolayer with 4-fold symmetry as measured by scanning tunneling microscopy. ALD pulses of trimethyl aluminum and H2O nucleate on the TiOPc, resulting in a uniform deposition of Al2O3, as confirmed by atomic force microscopy and cross-sectional transmission electron microscopy. The field-effect transistors (FETs) formed using this process have a leakage current of 0.046 pA/μm(2) at 1 V gate bias with 3.0 nm equivalent oxide thickness, which is a lower leakage current than prior reports. The n-branch of the FET yielded a subthreshold swing of 80 mV/decade.

In Situ Observation of Initial Stage in Dielectric Growth and Deposition of Ultrahigh Nucleation Density Dielectric on Two-Dimensional Surfaces.

Several proposed beyond-CMOS devices based on two-dimensional (2D) heterostructures require the deposition of thin dielectrics between 2D layers. However, the direct deposition of dielectrics on 2D materials is challenging due to their inert surface chemistry. To deposit high-quality, thin dielectrics on 2D materials, a flat lying titanyl phthalocyanine (TiOPc) monolayer, deposited via the molecular beam epitaxy, was employed to create a seed layer for atomic layer deposition (ALD) on 2D materials, and the initial stage of growth was probed using in situ STM. ALD pulses of trimethyl aluminum (TMA) and H2O resulted in the uniform deposition of AlOx on the TiOPc/HOPG. The uniformity of the dielectric is consistent with DFT calculations showing multiple reaction sites are available on the TiOPc molecule for reaction with TMA. Capacitors prepared with 50 cycles of AlOx on TiOPc/graphene display a capacitance greater than 1000 nF/cm(2), and dual-gated devices have current densities of 10(-7)A/cm(2) with 40 cycles.

Selective Chemical Response of Transition Metal Dichalcogenides and Metal Dichalcogenides in Ambient Conditions

To fabricate practical devices based on semiconducting two-dimensional (2D) materials, the source, channel, and drain materials are exposed to ambient air. However, the response of layered 2D materials to air has not been fully elucidated at the molecular level. In the present report, the effects of air exposure on transition metal dichalcogenides (TMD) and metal dichalcogenides (MD) are studied using ultrahigh-vacuum scanning tunneling microscopy (STM). The effects of a 1-day ambient air exposure on MBE-grown WSe2, chemical vapor deposition (CVD)-grown MoS2, and MBE SnSe2 are compared. Both MBE-grown WSe2 and CVD-grown MoS2 display a selective air exposure response at the step edges, consistent with oxidation on WSe2 and adsorption of hydrocarbon on MoS2, while the terraces and domain/grain boundaries of both TMDs are nearly inert to ambient air. Conversely, MBE-grown SnSe2, an MD, is not stable in ambient air. After exposure in ambient air for 1 day, the entire surface of SnSe2 is decomposed to SnOx and SeOx, as seen with X-ray photoelectron spectroscopy. Since the oxidation enthalpy of all three materials is similar, the data is consistent with greater oxidation of SnSe2 being driven by the weak bonding of SnSe2.

Density functional theory molecular dynamics simulations and experimental measurements of a-HfO 2 /a-SiO/SiGe(001) and a-HfO 2 /a-SiO 2 /SiGe(001) interfaces

To determine the optimal interface between a-HfO2 igh-K oxide and Si0.5Ge0.5(001), density functional theory molecular dynamics (DFTMD) simulations of several amorphous stoichiometric and sub-stoichiometric SiOxNy interlayers were performed. The stack with oxygen deficient a-SiO interlayer demonstrated superior electric properties because it avoided all dangling bond formation. Experimental studies confirmed that a nearly pure SiOx interface between a-HfO2 and SiGe(001) could be formed which correlated with a low interface state density.

Reconfigurable Electric Double Layer Doping in an MoS 2 Nanoribbon Transistor

A back-gated multilayer nanoribbon molybdenum disulfide (MoS2) transistor grown by chemical vapor transport and doped using polyethylene oxide cesium perchlorate is fabricated and characterized. Ions in the polymer dielectric are directed by side gates to the source and drain access regions where they form electric double layers (EDLs) that control the carrier densities. This allows the junctions of the same transistor channel to be reconfigured as an n-MOSFET, p-MOSFET, and as a tunnel field-effect transistors. The EDLs are formed at room temperature and then locked into place by cooling the polymer below the glass transition temperature (~240 K). Transport measurements are presented and explained using simulated band diagrams. Both n and p-conduction in MoS2 is demonstrated using solid polymer ion doping, enabling characterization of a semiconductor in which the doping of the same channel has been reconfigured to form three different transistor configurations.