Immanuel Mueller

Bonding wire for connecting pad and pin of chip, has outer and inner layers, where inner layer has high conductivity, low bending stiffness, low breaking load and low tensile strength than that of outer layers and wire is designed as tape

Bond connection for contact surfaces in e.g. integrated circuit, has bond wires that are arranged one upon other and connected with each other, where one of the bond wires is broader and/or thinner than other bond wire

Bonding wire and bond using a bonding wire

Multilayer bonding ribbon

Contact wire for contacting two contact surfaces, has contour of cross-sectional surface of contact wire, which has form deviating from circular shape and square shape with two different long sides

ELECTRICAL BOND CONNECTION SYSTEM

Bond and method for bonding two contact surfaces

BONDING WIRE FOR CONNECTION BETWEEN CONTACTING SURFACES AND BONDING WIRE CONNECTION PORTION BETWEEN CONTACTING SURFACES

CONNECTION ARRANGEMENT WITH A MULTILAYER RIBBON BOND WIRE

Verbindungsanordnung mit einem mehrschichtigen Bondflachdraht