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Manfred Reinold

Bosch

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Featured researches published by Manfred Reinold.

international interconnect technology conference | 2015

Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices

David Gross; Sabine Haag; Manfred Reinold; Martin Schneider-Ramelow; Klaus-Dieter Lang

Thick electroplated Cu bond pads have lately been demonstrated to enable heavy Cu wire-bonding but the Cu oxides necessitate an additional cleaning step after the die-attach. To avoid such cleaning, the use of a thin Al layer is tested for its passivating ability on Cu bond pads and its suitability for the bonding process. Results show a significant improvement of the oxidation resistance and bonding performance.

Archive | 1996

Sonic or ultrasonic wire welding apparatus

Manfred Reinold; Ingo Kesel

Archive | 2006

Bonding wire for connecting pad and pin of chip, has outer and inner layers, where inner layer has high conductivity, low bending stiffness, low breaking load and low tensile strength than that of outer layers and wire is designed as tape

Thomas Kaden; Immanuel Mueller; Manfred Reinold

Archive | 2006

Bond connection for contact surfaces in e.g. integrated circuit, has bond wires that are arranged one upon other and connected with each other, where one of the bond wires is broader and/or thinner than other bond wire

Thomas Kaden; Immanuel Mueller; Manfred Reinold

Archive | 2007

Bonding wire and bond using a bonding wire

Manfred Reinold; Thomas Kaden; Immanuel Mueller

Archive | 2007

Multilayer bonding ribbon

Manfred Reinold; Thomas Kaden; Immanuel Mueller

Archive | 2002

Werkzeugkopf zum Befestigen eines elektrischen Leiters auf der Kontaktfläche eines Substrates und Verfahren zum Durchführen der Befestigung

Dirk Brinkmann; Thomas Kaden; Manfred Reinold

Archive | 2002

Work-tool head for fixing electrical conductor on contact surface of substrate e.g. for microprocessors, uses converter for converting linear oscillations into radial oscillations

Dirk Brinkmann; Thomas Kaden; Manfred Reinold

Microelectronic Engineering | 2016

Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads

David Gross; Sabine Haag; Manfred Reinold; Martin Schneider-Ramelow; Klaus-Dieter Lang

Archive | 2006

Contact wire for contacting two contact surfaces, has contour of cross-sectional surface of contact wire, which has form deviating from circular shape and square shape with two different long sides

Thomas Kaden; Immanuel Mueller; Manfred Reinold

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Immanuel Mueller

Bosch

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Thomas Kaden

Bosch

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David Gross

Bosch

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Dirk Brinkmann

Bosch

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Sabine Haag

Bosch

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Bjoern Erbe

Bosch

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Martin Rittner

Bosch

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Arno Altpeter

Bosch

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Bernd Minkenberg

Bosch

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Ingo Kesel

Bosch

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