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Ingo Uhlendorf

Infineon Technologies

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Publication

Featured researches published by Ingo Uhlendorf.

Archive | 2003

Method for the solder-stop structuring of elevations on wafers

Axel Brintzinger; Ingo Uhlendorf; Andre Schenk; Alexander Wollanke

Archive | 2002

Process for solder-stop structuring protrusions on wafers such as three dimensional contact structures for improving integration comprises depositing a resist on the three dimensional structure, and further processing

Axel Brintzinger; Andre Schenk; Ingo Uhlendorf; Alexander Wollanke

Archive | 2005

Arrangement for reducing the electrical crosstalk on a chip

Axel Brintzinger; Octavio Trovarelli; Ingo Uhlendorf; Stefan Ruckmich; David Wallis; Fritz Uhlendorf; Helga Uhlendorf

Archive | 2003

Process and arrangement for the selective metallization of 3D structures

Ingo Uhlendorf

Archive | 2003

Method for forming three-dimensional structures on a substrate

Axel Brintzinger; Ingo Uhlendorf

Archive | 2004

Wafer structure method for creating three-dimensional structures on wafers in the form of bumps spread on each wafer, with each bump linked electrically to a bond pad via a reroute layer

Axel Brintzinger; Ingo Uhlendorf

Archive | 2004

Anordnung zur Verringerung des elektrischen Übersprechens auf einem Chip Arrangement for reducing the electrical crosstalk on a chip

Axel Brintzinger; Stefan Ruckmich; Octavio Trovarelli; Ingo Uhlendorf; David Wallis

Archive | 2004

Making wiring circuit panel, employs structured masking layers to define through-contact locations, with selective use of protective layers when depositing conductor structures

Axel Brintzinger; Stefan Ruckmich; Octavio Trovarelli; Ingo Uhlendorf; David Wallis

Archive | 2003

Verbindung zwischen einem Halbleiterchip und einer äußeren Leiterstruktur und Verfahren zu ihrer Herstellung

Axel Brintzinger; Octavlo Trovarelli; Ingo Uhlendorf; David Wallis

Archive | 2003

Verbindung zwischen einem Halbleiterchip und einer äußeren Leiterstruktur und Verfahren zu ihrer Herstellung Connection between a semiconductor chip and an outer conductor structure and process for their preparation

Axel Brintzinger; Octavlo Trovarelli; Ingo Uhlendorf; David Wallis

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Axel Brintzinger

Infineon Technologies

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Alexander Wollanke

Infineon Technologies

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Andre Schenk

Infineon Technologies

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Octavio Trovarelli

Infineon Technologies

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Octavlo Trovarelli

Infineon Technologies

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Stefan Ruckmich

Infineon Technologies

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David Wallis

Wallis

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