Octavio Trovarelli

Method for attaching dice to a package and arrangement of dice in a package

Method for protecting the redistribution layer on wafers/chips

Method for producing a rewiring printed circuit board

Process for producing layer structures for signal distribution

Arrangement and process for protecting fuses/anti-fuses

Method for improving the mechanical properties of BOC module arrangements

Protecting wiring on wafers/chips comprises covering wafer with wiring on its whole surface with organic layer to protect wiring from corrosion and oxidation and form sealed coating

Process for producing metallic interconnects and contact surfaces on electronic components

Arrangement for reducing the electrical crosstalk on a chip

Process for producing a chip arrangement provided with a molding compound