Irfan Anjum Badruddin

A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

Currently, the portable electronic products trend to high speed, light weight, miniaturization and multifunctionality. In that field, solder joint reliability in term of both drop impact and thermal cycling loading conditions is a great concern for portable electronic products. The transition to lead-free solder happened to coincide with a dramatic increase in portable electronic products. Sn–Ag–Cu (SAC) is now recognized as the standard lead free solder alloy for packaging interconnects in the electronics industry. The present study reviews the reliability of different Ag-content SAC solder joints in term of both thermal cycling and drop impact from the viewpoints of bulk alloy microstructure and tensile properties. The finding of the study indicates that the best SAC composition for drop impact performance is not necessarily the best composition for optimum thermal cycling reliability. The level of Ag-content in SAC solder alloy can be an advantage or a disadvantage depending on the application, package and reliability requirements. As a result, most component assemblers are using at least two (and in many cases even more) lead-free solder sphere alloys to meet various package requirements.

Analysis of Heat and Mass Transfer in a Vertical Annular Porous Cylinder Using FEM

The present study is intended to study heat and mass transfer in a vertical annular cylinder embedded with saturated porous medium. The inner surface of cylinder is maintained at uniform wall temperature and uniform wall concentration. The governing partial differential equations are non-dimensionalised and solved by using finite element method (FEM). The porous medium is discritised using triangular elements with uneven element size. Large number of smaller-sized elements are placed near the walls of the annulus to capture the smallest variation in solution parameters. The results are reported for both aiding and opposing flows. The effects of various non-dimensional numbers such as buoyancy ratio, Lewis number, Rayleigh number, aspect ratio, etc on heat and mass transfer are discussed. The temperature and concentration profiles are presented.

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and high- Ag-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC alloy was considered as a solution for both issues. However, this approach may compromise the thermal-cycling performance of the solders. Therefore, to enhance the thermal-cycling reliability of low-Ag-content SAC alloys without sacrificing their drop-impact performance, alloying elements such as Mn, Ce, Ti, Bi, In, Sb, Ni, Zn, Al, Fe, and Co were selected as additions to these alloys. However, research reports related to these modified SAC alloys are limited. To address this paucity, the present study reviews the effect of these minor alloying elements on the solder joint reliability of low-Ag-content SAC alloys in terms of thermal cycling and drop impact. Addition of Mn, Ce, Bi, and Ni to low-Ag-content SAC solder effectively improves the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Taking into consideration the improvement in the bulk alloy microstructure and mechanical properties, wetting properties, and growth suppression of the interface intermetallic compound (IMC) layers, addition of Ti, In, Sb, Zn, Al, Fe, and Co to low-Ag-content SAC solder has the potential to improve the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Consequently, further investigations of both thermal-cycling and drop reliability of these modified solder joints must be carried out in future work.

Conjugate Heat Transfer in an Annulus with Porous Medium Fixed Between Solids

Conjugate heat transfer is an important area of research which has been in demand due to its applications related to various scientific and engineering fields. The current research is focused to study the heat transfer in a porous medium sandwiched between two solid walls of an annular vertical cylinder. The prime focus of the current study was to evaluate the effect of solid wall thickness, the influence of variable wall thickness at inner and the outer radius, the conductivity ratio and the solid wall conductivity ratio on the heat transfer characteristics of the porous medium. The surface at inner and outer radii of the annulus is maintained isothermally at

Dufour and Soret Effects on Square Porous Annulus

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Heat transfer in porous medium embedded with vertical plate: Non-equilibrium approach - Part A

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Heat and mass transfer in porous cavity: Assisting flow

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