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Publication


Featured researches published by Iwao Ichikawa.


Archive | 1980

Apparatus for placing chip type circuit elements on a board

Iwao Ichikawa; Kenichiro Kaimori


Archive | 1982

Apparatus for feeding electric circuit elements

Teruyoshi Noda; Iwao Ichikawa


Archive | 1980

Method and apparatus for manufacturing hybrid integrated circuits

Mitsuo Ohsawa; Yoshiteru Noda; Iwao Ichikawa; Katsumi Yamamoto


Archive | 1994

Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device

Norio Kawatani; Iwao Ichikawa; Kazuaki Suzuki; Yukio Yamada


Archive | 1995

Thermocompression bonding equipment

Iwao Ichikawa; Norio Kawatani; Kazuaki Suzuki; Yukio Yamada


Archive | 1980

Apparatus for transferring parts or the like

Teruyoshi Noda; Iwao Ichikawa; Toshio Takahashi


Archive | 1999

Component mounting machine and component mounting method

Iwao Ichikawa; Norio Kawatani; Kazumasa Osoniwa; Manabu Yamauchi; 学 山内; 典夫 川谷; 岩夫 市川; 和正 獺庭


Archive | 1995

Apparatus for separating release film from adhesive film and method therefor

Iwao Ichikawa; Norio Kawatani; Kazuaki Suzuki; Yukio Yamada; Toyoji Yamazaki; 豊司 山崎; 幸男 山田; 典夫 川谷; 岩夫 市川; 和明 鈴木


Archive | 1998

Health managing apparatus and method, health managing method record medium and health managing input device

Iwao Ichikawa; Tamiaki Matsuura; Shogo Takahashi; Manabu Yamauchi; 学 山内; 岩夫 市川; 民明 松浦; 省吾 高橋


Archive | 1994

Thermocompression bonding device

Iwao Ichikawa; Norio Kawatani; Kazuaki Suzuki; Yukio Yamada; 幸男 山田; 典夫 川谷; 岩夫 市川; 和明 鈴木

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