J. Jasinski

Rapid thermal annealing of InAs/GaAs quantum dots under a GaAs proximity cap

The effect of postgrowth rapid thermal annealing (RTA) on GaAs proximity-capped structures with self-assembled InAs/GaAs quantum dots (QDs) is investigated using transmission electron microscopy (TEM) and photoluminescence (PL). As can be seen from the TEM images, QDs increase their lateral sizes with increasing annealing temperature (up to 700 °C). QDs cannot be distinguished after RTA at temperature 800 °C or higher, and substantial thickening of the wetting layer can be seen instead. The main PL peak blueshifts as a result of RTA. We propose that in the as-grown sample as well, as in samples annealed at temperatures up to 700 °C, the peak is due to the QDs. After RTA at 800 °C and higher the PL peak is due to a modified wetting layer. Relatively fast dissolution of QDs is explained in terms of strain-induced lateral Ga/In interdiffusion. It is proposed that such a process may be of importance in proximity-capped RTA, when no group-III vacancy formation takes place at the sample/capping interface.

Evolution of deep centers in GaN grown by hydride vapor phase epitaxy

Evolution of deep centers in GaN grown by hydride vapor phase epitaxy Z-Q. Fang and D.C. Look Semiconductor Research Center, Wright State University, Dayton, Ohio 45435 J. Jasinski, M. Benamara, and Z Liliental-Weber Lawrence Berkeley National Laboratory, Berkeley, California 94720 R.J. Molnar Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts Abstract Deep centers and dislocation densities in undoped n GaN, grown by hydride vapor phase epitaxy (HVPE), were characterized as a function of the layer thickness by deep level transient spectroscopy and transmission electron microscopy, respectively. As the layer thickness decreases, the variety and concentration of deep centers increase, in conjunction with the increase of dislocation density. Based on comparison with electron- irradiation induced centers, some dominant centers in HVPE GaN are identified as possible point defects.

Electron Beam and Optical Depth Profiling of Quasibulk GaN

Electron beam and optical depth profiling of thick (5.5–64 μm) quasibulk n-type GaN samples, grown by hydride vapor-phase epitaxy, were carried out using electron beam induced current (EBIC), microphotoluminescence (PL), and transmission electron microscopy (TEM). The minority carrier diffusion length, L, was found to increase linearly from 0.25 μm, at a distance of about 5 μm from the GaN/sapphire interface, to 0.63 μm at the GaN surface, for a 36-μm-thick sample. The increase in L was accompanied by a corresponding increase in PL band-to-band radiative transition intensity as a function of distance from the GaN/sapphire interface. We attribute the latter changes in PL intensity and minority carrier diffusion length to a reduced carrier mobility and lifetime at the interface, due to scattering at threading dislocations. The results of EBIC and PL measurements are in good agreement with the values for dislocation density obtained using TEM.

Synthesis of GaNxAs1−x thin films by pulsed laser melting and rapid thermal annealing of N+-implanted GaAs

We present a systematic investigation on the formation of the highly mismatched alloy GaN{sub x}As{sub 1-x} using N{sup +}-implantation followed by a combination of pulsed laser melting and rapid thermal annealing. Thin films of GaN{sub x}As{sub 1-x} with x as high as 0.016 and an activation efficiency of the implanted N up to 50% have been synthesized with structural and optical properties comparable to films grown by epitaxial deposition techniques with similar substitutional N content. The effects of N{sup +} implantation dose, laser energy fluence and rapid thermal annealing temperature on the N incorporation as well as optical and structural properties of the GaN{sub x}As{sub 1-x} films are discussed.

Characterization of free-standing hydride vapor phase epitaxy GaN

A free-standing GaN template grown by hydride vapor phase epitaxy has been characterized by transmission electron microscopy (TEM). The TEM investigation was augmented by x-ray diffraction, defect delineation etching process followed by imaging with atomic force microscopy and variable temperature photoluminescence. The density of dislocations near the N face was determined to be, in order, 3±1×107, 4±1×107, and about 1×107 cm−2 by cross-sectional TEM, plan-view TEM, and a defect revealing etch, respectively. The same methods on the Ga face revealed the defect concentration to be, in order, less than 1×107 cm−2 by plan-view TEM, less than 5×106 cm−2 by cross-sectional TEM, and 5×105 cm−2 by defect revealing hot H3PO4 acid, respectively. The full width at half maximum of the symmetric (0002) x-ray diffraction peak was 69 and 160 arc sec for the Ga and N faces, respectively. That for the asymmetric (101_4) peak was 103 and 140 arc sec for Ga and N faces, respectively. The donor bound exciton linewidth was a...

Unusual luminescence lines in GaN

A series of sharp intense peaks was observed in the low-temperature photoluminescence spectrum of unintentionally doped GaN in the photon energy range between 3.0 and 3.46 eV. We attributed the majority of these peaks to excitons bound to unidentified structural and surface defects. Most of the structural- and surface-related peaks (at 3.21, 3.32, 3.34, 3.35, 3.38, and 3.42 eV) were observed in Ga polar films. In N polar GaN, we often observed the 3.45 eV peak attributed to excitons bound to the inversion domain interfaces.

Electrical properties of InAlP native oxides for metal–oxide–semiconductor device applications

Data are presented on the insulating properties and capacitance-voltage (CV) characteristics of metal-oxide-semiconductor (MOS) device-thickness (below approx. 100 nm) native oxides formed by wet thermal oxidation of thin InAlP epilayers lattice matched to GaAs. Low leakage current densities of J=1.4 x 10-9 A/cm2 and J=8.7 x 10-11 A/cm2 are observed at an applied field of 1 MV/cm for MOS capacitors fabricated with 17 nm and 48 nm oxides, respectively. TEM images show that the In-rich interfacial particles which exist in 110 nm oxides are absent in 17 nm oxide films. Quasi-static capacitance-voltage measurements of MOS capacitors fabricated on both n-type and p-type GaAs show that the InAlP oxide-GaAs interface is sufficiently free of traps to support inversion, indicating an unpinned Fermi level. These data suggest that InAlP native oxides may be a viable insulator for GaAs MOS device applications.

Comparative study of Ga- and N-polar GaN films grown on sapphire substrates by molecular beam epitaxy

We report the surface, structural, and optical properties of typical Ga- and N-polar GaN films grown on sapphire substrates by molecular beam epitaxy. The Ga-polar films were grown on AlN buffer while the N-polar films were grown on GaN buffer layers. Atomic force microscopy imaging shows that the as-grown and chemically etched Ga-polar films have a flat and pitted surface while the N-polar surface is rougher with isolated columns or islands. Transmission electron microscopy demonstrates a low density of inversion domains in the Ga-polar films, while a much higher density of inversion domains was observed in the N-polar films. X-ray diffraction curves show a narrower (002) peak for Ga-polar films than that for N-polar films. On the other hand, both Ga- and N-polar films show a similar width of (104) peak. Despite their rough surfaces, high density of inversion domains, and broader (002) x-ray diffraction peaks, N-polar films with low dislocation density were demonstrated. In addition, higher PL efficiency...

Ultrafast response of As-implanted GaAs photoconductors

The photoconductive response of an optoelectronic switch fabricated from GaAs implanted with arsenic ions is measured to have a duration as short as 0.7 ps and a relaxation time as fast as 0.5 ps. The switching efficiency and relaxation time of the photoswitches using the As-implanted GaAs substrates are determined to be comparable to photoconductive devices employing GaAs grown by low-temperature molecular-beam epitaxy (LT-GaAs). For high dc-bias values, persistent photocurrent tails from transient leakage currents are found to be very prominent in bulk GaAs devices that were implanted with 10/sup 16/ cm/sup -2/ arsenic ions at 200 keV. This behavior has been determined to arise from substrate leakage current underneath the thin implanted layer, which recrystallizes and exhibits, as does LT-GaAs, arsenic-precipitate formation after annealing. In order to reduce this leakage current, multiple ion dosages with various implantation energies have been implemented. An epitaxial GaAs layer has also been implanted with arsenic ions, isolated from its semi-insulating substrate, and bonded onto a fused silica wafer in order to verify that the persistent tail response from the photoconductive switches was not actually due to the implanted region of the GaAs.

Polarity of GaN Grown on Sapphire by Molecular Beam Epitaxy with Different Buffer Layers

We report on polarity of GaN films grown on sapphire substrates by molecular beam epitaxy using different buffer layers and growth conditions. On high temperature AlN or GaN buffer layers, the GaN films typically show Ga or N-polarity, respectively. When low temperature (either AlN or GaN) buffer layers are employed, GaN films of both polarities can be grown, but these films have high density of inversion domains. Insertion of additional GaN/AlN quantum dot layers between the buffer layers and the GaN films provides strain relief and a significant improvement in the quality of the GaN epilayers.