J.L. Prince

Pole-residue formulation for transient simulation of high-frequency interconnects using householder LS curve-fitting techniques

As digital circuits approach the GHz range, and as the need for high performance wireless devices increases, new simulation tools which accurately characterize high frequency interconnects are needed. In this paper, a new macromodeling algorithm for time domain simulation of interconnects is presented. The algorithm incorporates Householder LS curve-fitting techniques. The approach generates a universal macromodeling tool that enables simulation of interconnects in a modified version of simulation program with integrated circuit emphasis (SPICE). This results in a method that conveniently incorporates accurate EM models of interconnects or experimental data into a circuit simulator. The time domain simulation results using this new tool are compared with results from other simulators.

Passive model order reduction of multiconductor interconnects

A new, computationally efficient, discrete model is presented for passive model order reduction of high-speed interconnects. The proposed model utilizes the theory of compact differences to reduce the number of degrees of freedom used in the discretization of the generalized Telegraphers equations. Lossy interconnects with position-dependent parameters can be handled.

SSO noise electrical performance limitations for PQFP packages

Factors which affect the simultaneous switching output (SSO) noise electrical performance of plastic quad flat pack (PQFP) packages are discussed in this paper. Limitations on PQFP package design for SSO noise are presented, along with a methodology for extracting the effective inductance limits for PQFP packages.

Influence of parameter distribution on simultaneous switching noise (SSN) for CMOS output drivers

Modeling of Simultaneous Switching Noise (SSN) has previously been done considering single-point parameters. This paper deals with the effects of parameter distributions on SSN. Parameters investigated include threshold voltage, drive strength, signal arrival times, power supply and temperature.

Effective inductance calculation for signal conductors above a lossy ground plane in the thin film packages

This paper presents a technique for calculating the effective inductance of a lossy ground plane, considering the mutual inductance effect of signal conductors. This technique takes into account the spatial current slew rate distribution on the ground plane.

Role of driver loading conditions on simultaneous switching noise

The nature of simultaneous switching noise (SSN) for CMOS drivers is analyzed and modeled. The modeling is done using CMOS equations and the results are verified using SPICE (simulation program with IC emphasis). The model includes the effect of parasitic inductance, load inductance and capacitance and negative feedback.<<ETX>>

Improved global rational approximation macromodeling algorithm for transient simulation of interconnects

In this paper, improvements for a new macromodeling technique that uses frequency-domain data are presented. The improvements extend its ability to lossless structures, increase its accuracy with pole-clustering, and ensure its validity with a passivity test.

Comparison of driver models for the computer-aided analysis of electronic packages

A study of the different models available for the simulation of a driver/receiver circuit is discussed. The four models discussed are based on (1) devices, (2) look-up tables, (3) behavioral equations, and (4) simple RC equivalents. These models are tested for their suitability for analysis of driver/receiver circuits of electronic packages. The speed of computation, output accuracy, and delay calculations are tested and compared.<<ETX>>

Influence of a Floating Plane on Effective Ground Plane Inductance in Multilayer Packages

The impact of a floating metal layer on the effective ground plane inductance has igated for multilayer packages with ground planes. Both thick and thin tries were examined. It was seen that the floating plane actually increases plane inductance in the multilayer package. An explanation for this is given by examining the current density in the floating and ground ground plane partial self-inductance and ground-signal partial mutual developing a package. Even unintentional metal layers such as heat potentially add to switchng noise in a multilayer package, especially if th close proximity to ground and signal layers.

Effect of floating conductive plane on effective inductance

The effect of a floating metallic plane on the effective inductance for simultaneously switching output (SSO) noise is shown and explained for two different technologies, multilayer and coplanar. The SSO noise advantage of the coplanar geometry with floating plane effects is shown.