J. N. Kuznia

High electron mobility transistor based on a GaN‐AlxGa1−xN heterojunction

In this letter we report the fabrication and dc characterization of a high electron mobility transistor (HEMT) based on a n‐GaN‐Al0.14Ga0.86N heterojunction. The conduction in our low pressure metalorganic chemical vapor deposited heterostructure is dominated by two‐dimensional electron gas at the heterostructure interface. HEMT devices were fabricated on ion‐implant isolated mesas using Ti/Au for the source drain ohmic and TiW for the gate Schottky. For a device with a 4 μm gate length (10 μm channel opening, i.e., source‐drain separation), a transconductance of 28 mS/mm at 300 K and 46 mS/mm at 77 K was obtained at +0.5 V gate bias. Complete pinchoff was observed for a −6 V gate bias.

Metal semiconductor field effect transistor based on single crystal GaN

In this letter we report the fabrication and characterization of a metal semiconductor field effect transistor (MESFET) based on single crystal GaN. The GaN layer was deposited over sapphire substrate using low pressure metalorganic chemical vapor deposition. MESFET devices were fabricated on isolated mesas using TiAu for the source and drain ohmic contacts and silver for the gate Schottky. For devices with a gate length of 4 μm (channel opening, i.e., source to drain separation of 10 μm), a transconductance of 23 mS/mm was obtained at −1 V gate bias. Complete pinch‐off was observed for a gate potential of −12 V.

High‐responsivity photoconductive ultraviolet sensors based on insulating single‐crystal GaN epilayers

We report on the fabrication and characterization of photoconductive ultraviolet detectors based on insulating single‐crystal GaN. The active layer (GaN) was deposited over basal‐plane sapphire substrates using a unique switched atomic‐layer‐epitaxy process. The sensors were measured to have a responsivity of 2000 A/W at a wavelength of 365 nm under a 5‐V bias. The responsivity remained nearly constant for wavelengths from 200 to 365 nm and dropped by three orders of magnitude within 10 nm of the band edge (by 375 nm). We estimate our sensors to have a gain of 6×103 (for wavelength 365 nm) and a bandwidth in excess of 2 kHz. The photosignal exhibited a linear behavior over five orders of incident optical power, thereby implying a very large dynamic range for these GaN‐based ultraviolet sensors.

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

We fabricated a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance. The device exhibited an excellent pinch‐off and a low parasitic output conductance in the saturation regime. We measured the cutoff frequency fT and the maximum oscillation frequency fmax as 11 and 35 GHz, respectively. These values are superior to the highest reported values for field effect transistors based on other wide band‐gap semiconductors such as SiC. These results demonstrate an excellent potential of AlGaN/GaN HFETs for microwave and millimeter wave applications.

Influence of buffer layers on the deposition of high quality single crystal GaN over sapphire substrates

Recently several research groups, including ours, have reported on the deposition of extremely high quality single crystal GaN layers over sapphire substrates. One of the keys to obtaining the high quality was the use of a thin AlN or GaN buffer layer between the sapphire substrate and the grown film. In this communication, we discuss the crystallinity and the influence of the buffer layer in controlling the crystalline, optical, and the electrical properties of the GaN depositions. We also compare the use of GaN and AlN as the buffer layer material. Our results indicate that the buffer layer thickness and the total film thickness are the key factors controlling the electrical, optical, and crystalline properties of the GaN depositions over sapphire substrates.

Schottky barrier photodetector based on Mg‐doped p‐type GaN films

In this letter we report the fabrication and characterization of Schottky barrier photodetectors on p‐type GaN films. These films were grown over basal plane sapphire substrates using low pressure metalorganic chemical vapor deposition and magnesium as the p‐type dopant. The current‐voltage and capacitance‐voltage characteristics were measured for Ti/Au Schottky barriers for a film with a p doping of 7×1017 cm−3. We measured a 1.5 V forward turn on and a 3 V reverse breakdown. The zero bias responsivity of a detector with 1 mm2 area was measured to be 0.13 A/W. For these photovoltaic detectors, the photoresponse was nearly constant from 200 to 365 nm and fell sharply by several orders of magnitude for wavelengths above 365 nm.

Growth of high optical and electrical quality GaN layers using low‐pressure metalorganic chemical vapor deposition

We report on the low‐pressure metalorganic chemical vapor deposition of high quality single‐crystal GaN layers over basal plane sapphire substrates. Optimization of growth conditions resulted in material with carrier densities of 1017 /cm3 at room temperature and corresponding mobilities around 350 cm2 /V s. The photoluminescence linewidths improved from 160 meV [full width at half maximum (FWHM)] to 25 meV (FWHM). With improved material quality we were able to observe the polar optical mode and the ionized impurity scattering regimes in the mobility versus temperature data. Good quality Schottky barriers were formed on the as‐grown material using a tungsten probe and an alloyed indium contact. Our observations indicate a direct correlation between electrical and optical characteristics of good material and strongly question nitrogen vacancies as the sole explanation for the high carrier densities observed in poor quality GaN growths.

Reactive ion etching of gallium nitride in silicon tetrachloride plasmasa)

The reactive ion etching characteristics of gallium nitride (GaN) in silicon tetrachloride plasmas (SiCl4, 1:1/SiCl4:Ar, and 1:1/SiCl4:SiF4) in the pressure range between 20 and 80 mTorr have been investigated. For the pressure range investigated, etch rates are found to be essentially identical for the different gas mixtures and also invariant with pressure. However for all gas mixtures, etch rates increased monotonically with increasing plasma self‐bias voltage exceeding 50 nm/min at 400 V. This is one of the highest etch rate ever reported for GaN. Smooth and anisotropic etch profiles are demonstrated for structures of submicrometer dimensions. The slight overcut observed in the etch profiles is attributed to the significant role of physical ion bombardment in the etching mechanism. Auger electron spectroscopy show that a wet etch in dilute HF is needed to clear the Si (in the form of SiOx) embedded in the near surface of GaN during etching thereby restoring etched surfaces to their virgin state.

Observation of a two‐dimensional electron gas in low pressure metalorganic chemical vapor deposited GaN‐AlxGa1−xN heterojunctions

We have confirmed the presence of a two‐dimensional electron gas (2DEG) in a wide band‐gap GaN‐AlxGa1−xN heterojunction by observing steplike features in the quantum Hall effect. The 2DEG mobility for a GaN‐Al0.13Ga0.87N heterojunction was measured to be 834 cm2/V s at room temperature. It monotonically increased and saturated at a value of 2626 cm2/V s at 77 K. The 2DEG mobility remained nearly constant for temperatures ranging from 77 to 4.2 K. Using Shubnikov–de Haas (SdH) measurements the two‐dimensional carrier concentration was estimated to be 1×1011 cm−2. The peak mobility for the 2DEG was found to decrease with the heterojunction aluminum compositions in excess of 13%.

High electron mobility GaN/AlxGa1−xN heterostructures grown by low‐pressure metalorganic chemical vapor deposition

In this letter we report the first observation of enhanced electron mobility in GaN/AlxGa1−xN heterojunctions. These structures were deposited on basal plane sapphire using low‐pressure metalorganic chemical vapor deposition. The electron mobility of a single heterojunction composed of 500 A of Al0.09Ga0.91N deposited onto 0.3 μm of GaN was around 620 cm2/V s at room temperature as compared to 56 cm2/V s for bulk GaN of the same thickness deposited under identical conditions. The mobility for the single heterojunction increased to a value of 1600 cm2/V s at 77 K whereas the mobility of the 0.3 μm GaN layer alone peaked at 62 cm2/V s at 180 K and decreased to 19 cm2/V s at 77 K. A 18‐layer multiple heterojunction structure displayed a peak mobility of 1980 cm2/V s at 77 K.