W. J. Schaff

Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures

Carrier concentration profiles of two-dimensional electron gases are investigated in wurtzite, Ga-face AlxGa1−xN/GaN/AlxGa1−xN and N-face GaN/AlxGa1−xN/GaN heterostructures used for the fabrication of field effect transistors. Analysis of the measured electron distributions in heterostructures with AlGaN barrier layers of different Al concentrations (0.15<x<0.5) and thickness between 20 and 65 nm demonstrate the important role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces. Characterization of the electrical properties of nominally undoped transistor structures reveals the presence of high sheet carrier concentrations, increasing from 6×1012 to 2×1013 cm−2 in the GaN channel with increasing Al-concentration from x=0.15 to 0.31. The observed high sheet carrier concentrations and strong confinement at specific interfaces of the N- and Ga-face pseudomorphic grown heterostructures can be explained as a consequence of interface charges induced by ...

Unusual properties of the fundamental band gap of InN

The optical properties of wurtzite-structured InN grown on sapphire substrates by molecular-beam epitaxy have been characterized by optical absorption, photoluminescence, and photomodulated reflectance techniques. These three characterization techniques show an energy gap for InN between 0.7 and 0.8 eV, much lower than the commonly accepted value of 1.9 eV. The photoluminescence peak energy is found to be sensitive to the free-electron concentration of the sample. The peak energy exhibits very weak hydrostatic pressure dependence, and a small, anomalous blueshift with increasing temperature.

Two dimensional electron gases induced by spontaneous and piezoelectric polarization in undoped and doped AlGaN/GaN heterostructures

Two dimensional electron gases in Al x Ga 12x N/GaN based heterostructures, suitable for high electron mobility transistors, are induced by strong polarization effects. The sheet carrier concentration and the confinement of the two dimensional electron gases located close to the AlGaN/GaN interface are sensitive to a large number of different physical properties such as polarity, alloy composition, strain, thickness, and doping of the AlGaN barrier. We have investigated these physical properties for undoped and silicon doped transistor structures by a combination of high resolution x-ray diffraction, atomic force microscopy, Hall effect, and capacitance‐voltage profiling measurements. The polarization induced sheet charge bound at the AlGaN/GaN interfaces was calculated from different sets of piezoelectric constants available in the literature. The sheet carrier concentration induced by polarization charges was determined

Superior radiation resistance of In1−xGaxN alloys: Full-solar-spectrum photovoltaic material system

High-efficiency multijunction or tandem solar cells based on group III–V semiconductor alloys are applied in a rapidly expanding range of space and terrestrial programs. Resistance to high-energy radiation damage is an essential feature of such cells as they power most satellites, including those used for communications, defense, and scientific research. Recently we have shown that the energy gap of In1−xGaxN alloys potentially can be continuously varied from 0.7 to 3.4 eV, providing a full-solar-spectrum material system for multijunction solar cells. We find that the optical and electronic properties of these alloys exhibit a much higher resistance to high-energy (2 MeV) proton irradiation than the standard currently used photovoltaic materials such as GaAs and GaInP, and therefore offer great potential for radiation-hard high-efficiency solar cells for space applications. The observed insensitivity of the semiconductor characteristics to the radiation damage is explained by the location of the band edge...

Small band gap bowing in In1−xGaxN alloys

High-quality wurtzite-structured In-rich In1−xGaxN films (0⩽x⩽0.5) have been grown on sapphire substrates by molecular beam epitaxy. Their optical properties were characterized by optical absorption and photoluminescence spectroscopy. The investigation reveals that the narrow fundamental band gap for InN is near 0.8 eV and that the band gap increases with increasing Ga content. Combined with previously reported results on the Ga-rich side, the band gap versus composition plot for In1−xGaxN alloys is well fit with a bowing parameter of ∼1.4 eV. The direct band gap of the In1−xGaxN system covers a very broad spectral region ranging from near-infrared to near-ultraviolet.

Undoped AlGaN/GaN HEMTs for microwave power amplification

Undoped AlGaN/GaN structures are used to fabricate high electron mobility transistors (HEMTs). Using the strong spontaneous and piezoelectric polarization inherent in this crystal structure a two-dimensional electron gas (2DEG) is induced. Three-dimensional (3-D) nonlinear thermal simulations are made to determine the temperature rise from heat dissipation in various geometries. Epitaxial growth by MBE and OMVPE are described, reaching electron mobilities of 1500 and 1700 cm/sup 2//Ns, respectively, For electron sheet density near 1/spl times/10/sup 13//cm/sup 2/, Device fabrication is described, including surface passivation used to sharply reduce the problematic current slump (dc to rf dispersion) in these HEMTs. The frequency response, reaching an intrinsic f/sub t/ of 106 GHz for 0.15 /spl mu/m gates, and drain-source breakdown voltage dependence on gate length are presented. Small periphery devices on sapphire substrates have normalized microwave output power of /spl sim/4 W/mm, while large periphery devices have /spl sim/2 W/mm, both thermally limited. Performance, without and with Si/sub 3/N/sub 4/ passivation are presented. On SiC substrates, large periphery devices have electrical limits of 4 W/mm, due in part to the limited development of the substrates.

Temperature dependence of the fundamental band gap of InN

The fundamental band gap of InN films grown by molecular beam epitaxy have been measured by transmission and photoluminescence spectroscopy as a function of temperature. The band edge absorption energy and its temperature dependence depend on the doping level. The band gap variation and Varshni parameters of InN are compared with other group III nitrides. The energy of the photoluminescence peak is affected by the emission from localized states and cannot be used to determine the band gap energy. Based on the results obtained on two samples with distinctly different electron concentrations, the effect of degenerate doping on the optical properties of InN is discussed.

Surface charge accumulation of InN films grown by molecular-beam epitaxy

A series of thin InN films down to 10 nm in thickness were prepared by molecular-beam epitaxy on either AlN or GaN buffers under optimized growth conditions. By extrapolating the fitted curve of sheet carrier density versus film thickness to zero film thickness, a strong excess sheet charge was derived, which must come from either the surface or the interface between InN and its buffer layer. Since metal contacts, including Ti, Al, Ni, and a Hg probe, can always form an ohmic contact on InN without any annealing, it is determined that at least part of the excess charge is surface charge, which was also confirmed by capacitance–voltage measurements.

Temperature activated conductance in GaN/AlGaN heterostructure field effect transistors operating at temperatures up to 300 °C

We report on the dc characteristics and microwave performance of AlGaN/GaN heterostructure field effect transistors in the temperature range from 25 to 300 °C. At temperatures above 200 °C, we observe the temperature activated shunt conductance which is independent of the gate voltage (the activation energy is 0.505 eV). The cutoff frequency and the maximum frequency of oscillations vary from 22 and 70 GHz at 25 °C to 5 and 4 GHz at 300 °C, respectively. The gate leakage current in the range of gate biases from −4 to +1 V is small and nearly proportional to the gate voltage even at 300 °C. At temperatures above 200 °C, the gate leakage current is temperature activated (the activation energy is 0.88 eV). These results show that deep traps strongly affect the AlGaN/GaN characteristics at elevated temperatures.

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

We fabricated a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance. The device exhibited an excellent pinch‐off and a low parasitic output conductance in the saturation regime. We measured the cutoff frequency fT and the maximum oscillation frequency fmax as 11 and 35 GHz, respectively. These values are superior to the highest reported values for field effect transistors based on other wide band‐gap semiconductors such as SiC. These results demonstrate an excellent potential of AlGaN/GaN HFETs for microwave and millimeter wave applications.