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Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Jack Chang Chien is active.

Publication


Featured researches published by Jack Chang Chien.


Archive | 2007

Interconnected ic packages with vertical smt pads

Chin-Tien Chiu; Cheemen Yu; Hem Takiar; Jack Chang Chien; Meng-ju Tsai


Archive | 2010

Semiconductor die having a redistribution layer

Chien-Ko Liao; Chin-Tien Chiu; Jack Chang Chien; Cheemen Yu; Hem Takiar


Archive | 2007

Method of fabricating a semiconductor package having through holes for molding back side of package

Chin-Tien Chiu; Hem Takiar; Chih-Chin Liao; Cheemen Yu; Ning Ye; Jack Chang Chien


Archive | 2007

Method of fabricating a semiconductor die having a redistribution layer

Chien-Ko Liao; Chin-Tien Chiu; Jack Chang Chien; Cheemen Yu; Hem Takiar


Archive | 2009

Methods of promoting adhesion between transfer molded ic packages and injection molded plastics for creating over-molded memory cards

Che-Jung Chang; Chin-Tien Chiu; Cheeman Yu; Hem Takiar; Jack Chang Chien; Ning Liu


Archive | 2007

METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING

Chin-Tien Chiu; Chih Chiang Tung; Hem Takiar; Jack Chang Chien; Cheemen Yu


Archive | 2007

TWO-SIDED SUBSTRATE LEAD CONNECTION FOR MINIMIZING KERF WIDTH ON A SEMICONDUCTOR SUBSTRATE PANEL

Chih-Chin Liao; Ning Ye; Cheemen Yu; Jack Chang Chien; Hem Takiar


Archive | 2005

Padless substrate for surface mounted components

Chih-Chin Liao; Ken Jian Ming Wang; Han-Shiao Chen; Chin-Tien Chiu; Jack Chang Chien; Shrikar Bhagath; Cheemen Yu; Hem Takiar


Archive | 2007

Method of minimizing kerf width on a semiconductor substrate panel

Chih-Chin Liao; Ning Ye; Cheemen Yu; Jack Chang Chien; Hem Takiar


Archive | 2007

SEMICONDUCTOR PACKAGE HAVING THROUGH HOLES FOR MOLDING BACK SIDE OF PACKAGE

Chin-Tien Chiu; Hem Takiar; Chih-Chin Liao; Cheemen Yu; Ning Ye; Jack Chang Chien

Collaboration


Dive into the Jack Chang Chien's collaboration.

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