Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Chih-Chin Liao is active.

Publication


Featured researches published by Chih-Chin Liao.


Archive | 2009

Stacked, interconnected semiconductor packages

Cheemen Yu; Chih-Chin Liao; Hem Takiar


Archive | 2010

Printed circuit board with coextensive electrical connectors and contact pad areas

Chih-Chin Liao; Han-Shiao Chen; Chin-Tien Chiu; Ken Jian Ming Wang; Cheemen Yu; Hem Takiar


Archive | 2005

Substrate warpage control and continuous electrical enhancement

Cheemen Yu; Ken Jian Ming Wang; Chin-Tien Chiu; Chih-Chin Liao; Han-Shiao Chen


Archive | 2011

RADIATION-SHIELDED SEMICONDUCTOR DEVICE

Suresh Upadhyayula; Hem Takiar; Chih-Chin Liao


Archive | 2008

Die package with asymmetric leadframe connection

Ming Hsun Lee; Chih-Chin Liao; Cheemen Yu; Hem Takiar


Archive | 2007

Method of forming a semiconductor die having a sloped edge for receiving an electrical connector

Cheemen Yu; Chih-Chin Liao; Hem Takiar


Archive | 2005

Substrate having minimum kerf width

Hem Takiar; Ken Jian Ming Wang; Chih-Chin Liao; Han-Shiao Chen


Archive | 2005

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Chin-Tien Chiu; Chih-Chin Liao; Ken Jian Ming Wang; Han-Shiao Chen; Cheeman Yu; Hem Takiar


Archive | 2005

Rounded contact fingers on substrate/PCB for crack prevention

Hem Takiar; Cheemen Yu; Ken Jian Ming Wang; Chin-Tien Chiu; Han-Shiao Chen; Chih-Chin Liao


Archive | 2009

High density three dimensional semiconductor die package

Cheemen Yu; Chih-Chin Liao; Hem Takiar

Collaboration


Dive into the Chih-Chin Liao's collaboration.

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