Jacob A. Bertrand

Critical tensile and compressive strains for cracking of Al2O3 films grown by atomic layer deposition

Al2O3 atomic layer deposition (ALD) is a model ALD system and Al2O3 ALD films are excellent gas diffusion barrier on polymers. However, little is known about the response of Al2O3 ALD films to strain and the potential film cracking that would restrict the utility of gas diffusion barrier films. To understand the mechanical limitations of Al2O3 ALD films, the critical strains at which the Al2O3 ALD films will crack were determined for both tensile and compressive strains. The tensile strain measurements were obtained using a fluorescent tagging technique to image the cracks. The results showed that the critical tensile strain is higher for thinner thicknesses of the Al2O3 ALD film on heat-stabilized polyethylene naphthalate (HSPEN) substrates. A low critical tensile strain of 0.52% was measured for a film thickness of 80 nm. The critical tensile strain increased to 2.4% at a film thickness of 5 nm. In accordance with fracture mechanics modeling, the critical tensile strains and the saturation crack densiti...

The mechanical robustness of atomic-layer- and molecular-layer-deposited coatings on polymer substrates

films was determined to be KIC= 1.89 0.10 and 0.17 0.02 MPa m 0.5 , respectively. From measurements of the saturated crack density, the critical interfacial shear stress was estimated to be c = 39.5 8.3 and 66.6 6.1 MPa, respectively. The toughness of nanometer-scale alumina was comparable to that of alumina thin films grown using other techniques, whereas alucone was quite brittle. The use of alucone as a spacer layer between alumina films was not found to increase the critical strain at fracture for the composite films. This performance is attributed to the low toughness of alucone. The experimental results were supported by companion simulations using fracture mechanics formalism for multilayer films. To aid future development, the modeling method was used to study the increase in the toughness and elastic modulus of the spacer layer required to render improved critical strain at fracture. These results may be applied to a broad variety of multilayer material systems composed of ceramic and spacer layers to yield robust coatings for use in chemical barrier and other applications.

Evaluating Al2O3 gas diffusion barriers grown directly on Ca films using atomic layer deposition techniques

Al2O3 gas diffusion barriers grown directly on Ca films using atomic layer deposition (ALD) techniques were evaluated using several methods based on Ca oxidation. The Al2O3 ALD films were grown on Ca films at 120 °C using trimethylaluminum and H2O as the reactants. The oxidation of the Ca films was then monitored versus time at 70 °C and ∼28% relative humidity either by measuring the electrical conductance of the Ca film or by recording the photographic image of the Ca film. In the photographic images, the Ca films revealed that the Al2O3 ALD films have a small number of pinhole defects that lead to Ca film oxidation areas that grow radially around the pinhole defect versus time. A burst of new oxidation areas also appeared suddenly at later times and grew radially versus time. This rapid “blooming” may be related to another type of defect caused by water corrosion of the Al2O3 ALD films. In the electrical conductance measurements, the conductance of the Ca film initially showed little change versus time....

12.3: Defect Visualization of Atomic Layer Deposition Enabled Polymer Barriers Using Fluorescent Tags

Nanometer thick alumina barrier coatings deposited using atomic layer deposition (ALD) can be used to enable flexible packaging to protect organic light emitting diodes (OLED) and other electronic/optoelectronic components from moisture-and oxygen-aided deterioration. Individual defects and cracks generated in the coating during processing, subsequent handling and application, allow the leakage of reactive species that may lead to device degradation. Therefore, novel fluorescent tags have been developed to visualize defects and damage, enabling rapid quality inspection of barrier layers. for ALD alumina coatings deposited on polyethylene naphthalate (PEN) substrates, the fluorescent taggant identified cracks ∼20nm in width and individual defects as small as ∼200nm in diameter. This novel approach, which is non-destructive and fully compatible with the optical inspection methods that are widely used in manufacturing, is expected to have a major impact on the quality control of flexible polymer packaging of OLED and other organic components or systems.