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Jae M. Park

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Publication

Featured researches published by Jae M. Park.

Archive | 2003

High frequency chip packages with connecting elements

Masud Beroz; Michael Warner; Lee Smith; Glenn Urbish; Teck-Gyu Kang; Jae M. Park; Yoichi Kubota

Archive | 2004

Solid state lighting device

Jae M. Park; Teck-Gyu Kang

Archive | 2003

Microelectronic packages with self-aligning features

Kyong-Mo Bang; Teck-Gyu Kang; Jae M. Park

Archive | 2005

Image sensor package and fabrication method

Teck-Gyu Kang; Michael Estrella; Jae M. Park; Kenneth Robert Thompson; Craig Mitchell; Belgacem Haba

Archive | 2004

Micro pin grid array with wiping action

Belgacem Haba; Masud Beroz; Giles Humpston; Jae M. Park

Archive | 2005

Components with posts and pads

Yoichi Kubota; Teck-Gyu Kang; Jae M. Park; Belgacem Haba

Archive | 2004

Microelectronic package comprising offset conductive posts on compliant layer

Belgacem Haba; Masud Beroz; Giles Humpston; Jae M. Park

Archive | 2007

Fine pitch microcontacts and method for forming thereof

Belgacem Haba; Yoichi Kubota; Teck-Gyu Kang; Jae M. Park

Archive | 2004

Microelectronic assemblies with springs

Belgacem Haba; Jae M. Park; Teck-Gyu Kang; Nicholas J. Colella

Archive | 2004

Package element and packaged chip having severable electrically conductive ties

David B. Tuckerman; Richard DeWitt Crisp; Belgacem Haba; Giles Humpston; Jae M. Park

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Collaboration

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Belgacem Haba

Samsung

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Teck-Gyu Kang

Altera

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David B. Tuckerman

Stanford University

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