James A Cunningham | Researchain

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IEEE Transactions on Reliability | 1970

Corrosion Resistance of Several Integrated-Circuit Metallization Systems

James A Cunningham; Clyde R. Fuller; C. T. Haywood

Accelerated life data are presented on several integratedcircuit metallization systems including Al, Mo-Au, Ti-Pt-Au, and a new system Ti: W-Au where the RF sputtered Ti: W layer is a pseudo alloy of 10-20 percent Ti in W. Life tests include total water immersion, high-pressure steam and 85°C/85 percent RH/bias on bare and plastic-encapsulated devices. Heat-age and resistivity-ratio data are presented showing the metallurgical stability of the Ti: W-Au system. The corrosion resistance decreases as Ti-Pt-Au > Ti: W-Au >> Mo-Au ? Al.

international electron devices meeting | 1970

The corrosion resistance of several integrated-circuit metallization systems

James A Cunningham; C.R. Fuller; C.T. Haywood

Accelerated life data are presented on several integrated-circuit metallization systems including Al, Mo-Au, Ti-Pt-Au, and a new system W:Ti-Au, where the r-f-sputtered W:Ti layer is a pseudo-alloy of 10-20% Ti in W. Life tests include total water immersion, high-pressure steam, and 85°C/85% RH/bias on bare and plastic-encapsulated devices. Heat age and resistivity-ratio data are presented showing the metallurgical stability of the W:Ti-Au system. In order of decreasing corrosion resistance, Ti-Pt-Au > W:Ti-Au > > Mo-Au ≥ Al.

Archive | 1967