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Dive into the research topics where Janos Farkas is active.

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Featured researches published by Janos Farkas.


Electrochemical and Solid State Letters | 2002

Effects of Particle Concentration on Chemical Mechanical Planarization

Kevin Cooper; Jennifer Cooper; Johannes Groschopf; John C. Flake; Yuri E. Solomentsev; Janos Farkas

Effects of particle concentration on removal rates in chemical mechanical planarization (CMP) were investigated. Experimental data shows the removal rate scales with the cubic root of weight percent solids and is proportional to mean separation distance between particles in the slurry. Results show similar removal rate scaling with solid concentration for both silicon dioxide and copper films. This work also identifies a critical solid concentration needed to initiate removal for oxide or copper surfaces. The effects of particles on copper surface oxidation and roughness are further characterized by voltammetry and atomic force microscopy. Results show copper films become progressively smoother with additional solids in the slurry.


Archive | 1997

Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers

Janos Farkas; Rajeev Bajaj; Melissa Freeman; David K. Watts; Sanjit Das


Archive | 1997

Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture

David K. Watts; Rajeev Bajaj; Sanjit Das; Janos Farkas; Chelsea Dang; Melissa Freeman; Jaime Saravia; Jason Gomez; Lance B Cook


Archive | 1996

Method for using ammonium salt slurries for chemical mechanical polishing (CMP)

Janos Farkas; Melissa Freeman


Archive | 2001

Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process

Janos Farkas; Brian G. Anthony; Abbas Guvenilir; Mohammed Rabiul Islam; Venkat Kolagunta; John Mendonca; Rajesh Tiwari; Suresh Venkatesan


Archive | 1998

Integrated circuit having a support structure

Nigel Cave; Kathleen C. Yu; Janos Farkas


Archive | 1997

Method of chemical mechanical planarization using copper coordinating ligands

David K. Watts; Janos Farkas; Jason Gomez; Chelsea Dang


Archive | 1996

Measuring slurry particle size during substrate polishing

Janos Farkas; James M. Mullins


Archive | 1996

Method for chemically-mechanically polishing a metal layer

Janos Farkas; Melissa Freeman


Archive | 1998

Chemical mechanical polishing(cmp) slurry of copper and application method thereof

Rajeev Bajaj; Lance B Cook; Chelsea Dang; Sanjit Das; Janos Farkas; Melissa Freeman; Jason Gomez; Jaime Saravia; David K. Watts; サンジト・ダス; ジェイソン、ゴメス; ジェイノス・ファーカス; ジェイム・エー・サラビア; チェルシー・ダン; デビッド・ワッツ; メリッサ・フリーマン; ラジーブ、バジャジュ; ランス・ビー・クック

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Kevin Cooper

Freescale Semiconductor

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