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Dive into the research topics where Rajeev Bajaj is active.

Publication


Featured researches published by Rajeev Bajaj.


Archive | 1997

Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers

Janos Farkas; Rajeev Bajaj; Melissa Freeman; David K. Watts; Sanjit Das


Archive | 1997

Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture

David K. Watts; Rajeev Bajaj; Sanjit Das; Janos Farkas; Chelsea Dang; Melissa Freeman; Jaime Saravia; Jason Gomez; Lance B Cook


Archive | 1996

Process for polishing a semiconductor device substrate

Sung C. Kim; Rajeev Bajaj; Mark A. Zaleski


Archive | 1997

Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor

Sung C. Kim; Lei Ping Lai; Rajeev Bajaj; Adam Manzonie


Archive | 1997

Method for polishing a semiconductor wafer using dynamic control

Sanjit Das; Subramoney Iyer; Olubunmi Adetutu; Rajeev Bajaj


Archive | 1997

Method for using a conductive tungsten nitride etch stop layer to form conductive interconnects and tungsten nitride contact structure

Rajan Nagabushnam; Rajeev Bajaj; Ram Venkataraman; Shyam Mattay; Subramoney Iyer


Archive | 1997

Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects

Rajeev Bajaj; Subramoney Iyer; Thom Kobayashi; Jaime Saravia; Mark G. Fernandes; David K. Watts


Archive | 1997

Method of chemical mechanical planarization using a water rinse to prevent particle contamination

David K. Watts; Rajeev Bajaj; Sanjit Das


Archive | 1998

Chemical mechanical polishing(cmp) slurry of copper and application method thereof

Rajeev Bajaj; Lance B Cook; Chelsea Dang; Sanjit Das; Janos Farkas; Melissa Freeman; Jason Gomez; Jaime Saravia; David K. Watts; サンジト・ダス; ジェイソン、ゴメス; ジェイノス・ファーカス; ジェイム・エー・サラビア; チェルシー・ダン; デビッド・ワッツ; メリッサ・フリーマン; ラジーブ、バジャジュ; ランス・ビー・クック


Archive | 1999

***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***Processing for polishing dissimilar conductive layers in a semiconductor device

Rajeev Bajaj; Janos Farkas; Sung C. Kim; Jaime Saravia

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