Janusz Pstruś

Density and surface tension of the Pb-Sn liquid alloys

The maximum bubble pressure method and the dilatometric method were used, respectively, in measurements of surface tensions and densities of Pb-Sn liquid alloys. The experiments were carried out in the temperature range from 573 to 1200 K for the pure Pb, pure Sn, and 7 alloys of the compositions 0.1, 0.2, 0.26, 0.36, 0.5, 0.7, and 0.9 mole fraction of Pb. A straight-line dependence on temperature was observed and fitted by the method of least squares both for the densities and the surface tensions. The calculated density isotherm at 673 K showed a positive deviation from the linearity over the entire range of composition, and the same tendency was seen at 1173 K for compositions higher than XPb=0.26. At the lower concentration of Pb, a nearly linear character of 1173 K isotherm was noted. In the case of surface tensions, both at the lowest and the highest temperatures (673 and 1173 K), the deviation from linearity with composition was negative, but deviation decreased with increasing temperature. The isotherms of the compositional dependence of surface tension calculated from the Butler model exhibit good agreement with experimental data.

Surface Tension, Density, and Molar Volume of Liquid Sb-Sn Alloys: Experiment Versus Modeling

Through the application of the maximum bubble pressure and dilatometric method, density and surface tension were investigated. The experiments were conducted in the temperature range from 583 K≤T≤1257 K. The surface tension was measured for pure antimony and for six liquid Sb-Sn alloys (mole fractions XSn=0.2, 0.4, 0.6, 0.8, 0.9, and 0.935 mm2) and measurements of the density were only for alloys. It has been observed that both surface tension and density show linear dependence on temperature. The temperature-concentration relation of both surface tension and density were determined with minimization procedures. The surface tension isotherms calculated at 873 K and 1273 K show slight negative deviations from linearity changes, but the observed maximal differences did not exceed 30 mN · m−1. The surface tension calculated from Butler’s model was higher than the experimental value for most concentrations and also showed curvilinear temperature dependence. The experimental densities and the molar volumes of the Sb-Sn liquid alloys conform very closely to ideal behavior with differences comparable to the experimental errors.

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Purpose – The purpose of this paper is to investigate the influence of In additions on the wetting properties of the Sn2.86Ag0.40Cu (in wt%) eutectic‐based alloys, on a copper substrate, in the presence of a flux. The main goal was to find correlations between the results of the wetting balance (WB) and the sessile drop (SD) method, in relation to the contact angles.Design/methodology/approach – The WB method was applied for the wetting measurements, at 250°C, in an air atmosphere and in the presence of a flux. The SD measurements were conducted at the same temperature, in the presence of the same flux, but in an Ar atmosphere, while the maximum bubble pressure (MBP) and dilatometric measurements were conducted in an Ar+H2 atmosphere. The density data from the dilatometric method were used for the determination of the surface tension by means of MBP, and the WB method was used to determine the surface and interfacial tension. Next, the surface tension data from these two methods were compared. The WB data...

Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces

The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250°C and reflow time of 3, 8, 15, 30, and 60 min. Wetting tests were performed at 230, 250, 280, 320, and 370°C for an alloy containing 1.5 at.% of indium, in order to determine activation energy of diffusion. Solidified solder/substrate couples were studied using scanning electron microscopy (SEM), the intermetallic phases from Cu-Zn system which formed at the solder/substrate interface were identified, and their growth kinetics was investigated. The e-CuZn4 was formed first, as a product of the reaction between liquid solder and the Cu substrate, whereas γ-Cu5Zn8 was formed as a product of the reaction between e-CuZn4 and the Cu substrate. With increasing wetting time, the thickness of e-CuZn4 increases, while the thickness of e-CuZn4 does not change over time for indium-doped solders and gradually disappears over time for Sn-Zn eutectic solder.