Przemysław Fima

Thermophysical properties and wetting behavior on Cu of selected SAC alloys

Purpose – The purpose of this paper is to study the effect of copper concentration in near‐eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension, density; as well as wetting behavior on copper substrates at 523 K.Design/methodology/approach – Viscosity, surface tension, and density were studied over a broad range of temperatures with the recently developed Roach‐Henein method. The obtained results were compared with the data from modified capillary, maximum bubble pressure, wetting balance and dilatometric measurements. Wetting angles measured with wetting balance method were compared with the results of sessile drop measurements.Findings – The results obtained indicate that increasing concentration of copper in the alloy results in higher density, surface tension and viscosity, but differences resulting from copper concentration on wettability are relatively small. At 523 K, the density is: 7.097, 7.186, 7.232 g cm−3, the surface tension is: 538.1, 553.5, 556.7 m Nm−1...

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Purpose – The purpose of this paper is to investigate the influence of In additions on the wetting properties of the Sn2.86Ag0.40Cu (in wt%) eutectic‐based alloys, on a copper substrate, in the presence of a flux. The main goal was to find correlations between the results of the wetting balance (WB) and the sessile drop (SD) method, in relation to the contact angles.Design/methodology/approach – The WB method was applied for the wetting measurements, at 250°C, in an air atmosphere and in the presence of a flux. The SD measurements were conducted at the same temperature, in the presence of the same flux, but in an Ar atmosphere, while the maximum bubble pressure (MBP) and dilatometric measurements were conducted in an Ar+H2 atmosphere. The density data from the dilatometric method were used for the determination of the surface tension by means of MBP, and the WB method was used to determine the surface and interfacial tension. Next, the surface tension data from these two methods were compared. The WB data...

Surface tension modelling of liquid Cd–Sn–Zn alloys

Abstract The thermodynamic model in conjunction with Butler equation and the geometric models were used for the surface tension calculation of Cd–Sn–Zn liquid alloys. Good agreement was found between the experimental data for limiting binaries and model calculations performed with Butler model. In the case of ternary alloys, the surface tension variation with Cd content is better reproduced in the case of alloys lying on vertical sections defined by high Sn to Zn molar fraction ratio. The calculated surface tension is in relatively good agreement with the available experimental data. In addition, the surface segregation of liquid ternary Cd–Sn–Zn and constituent binaries has also been calculated.

Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces

The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250°C and reflow time of 3, 8, 15, 30, and 60 min. Wetting tests were performed at 230, 250, 280, 320, and 370°C for an alloy containing 1.5 at.% of indium, in order to determine activation energy of diffusion. Solidified solder/substrate couples were studied using scanning electron microscopy (SEM), the intermetallic phases from Cu-Zn system which formed at the solder/substrate interface were identified, and their growth kinetics was investigated. The e-CuZn4 was formed first, as a product of the reaction between liquid solder and the Cu substrate, whereas γ-Cu5Zn8 was formed as a product of the reaction between e-CuZn4 and the Cu substrate. With increasing wetting time, the thickness of e-CuZn4 increases, while the thickness of e-CuZn4 does not change over time for indium-doped solders and gradually disappears over time for Sn-Zn eutectic solder.

Microstructure and Thermal Analysis of As-Cast Ag-Bi-Ni alloys

The calculated liquidus projection of the Ag-Bi-Ni ternary system has been experimentally examined. Alloys were prepared by induction melting, and their microstructure studied by scanning electron microscopy coupled with energy dispersive x-ray spectroscopy. Of the primary solidification phases, (Ni) solidifies over the largest concentration range, although it was found to be narrower than calculated. The range in which Bi3Ni is the primary solidification phase was found to be broader than calculated. Also, the liquid miscibility gap is broader than predicted from assessed thermodynamic parameters. Differential thermal analysis was used to study temperatures of phase transitions of as-cast alloys, and recorded temperatures of melting of Bi3Ni and BiNi phases in ternary alloys agree well with those calculated.