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Dive into the research topics where Jay Deavis Baker is active.

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Featured researches published by Jay Deavis Baker.


international electronics manufacturing technology symposium | 1991

Inert gas wave soldering evaluation

James Edward Altpeter; Lawrence Leroy Kneisel; Jay Deavis Baker

Production modules were soldered using adipic acid/isopropanol as a flux and atomized formic acid to further enhance oxide reduction over the molten soldered module. The objectives of the evaluation were to assess system capability, measurable performance versus conventional wave soldering equipment performance, and environmental impact. The system capability for overall machine performance, from belt speeds to repeatable solder heights and solder joints, has demonstrated the effectiveness of inert gas soldering over current conventional soldering technology. The inert gas system performance versus conventional process performance using production level product has demonstrated the feasibility the system has for production implementation by lowering the solder defect rate by a fourfold improvement. The positive environmental impact of inert gas soldering consists in reductions in volatile organic compounds, lead, and chlorofluorocarbon (CFC) emissions. Cost comparison of inert gas soldering to conventional wave solder systems is very favorable when total costs of the cleaning machines with CFCs and floor space are compared.<<ETX>>


Archive | 1994

Method for fabricating an undercoated chip electrically interconnected to a substrate

Jay Deavis Baker; Cuong Van Pham; Robert Edward Belke


Archive | 1994

Micro soldering system for electronic components

Jay Deavis Baker; Myron Lemecha; K. McMillan Ii Richard; Kenneth Alan Salisbury; Paul Elwin Stevenson; Thomas B. Merala; Wells L. Green; Matti Mikkor; Bernard A Meyer


Archive | 1994

Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population

Kenneth Alan Salisbury; Pawel Kalinowski; Jay Deavis Baker


Archive | 1997

Apparatus and method of assembling vehicle instrument panel structural and electronic components

Jay Deavis Baker; Lawrence Leroy Kneisel; Myron Lemecha


Archive | 1996

Apparatus for storing and cooling electronic devices and/or modules in a vehicle

Vivek Amir Jairazbhoy; Prathap Amerwai Reddy; John Trublowski; Jay Deavis Baker; Lawrence Leroy Kneisel


Archive | 1993

Silicon micromachined CO2 cleaning nozzle and method

Lawrence Leroy Kneisel; Jay Deavis Baker; Lakhi Nandlal Goenka


Archive | 1987

Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors

Jay Deavis Baker


Archive | 1999

Bonding of semiconductor power devices

Jay Deavis Baker; Brian John Hayden; Cuong Van Pham


Archive | 1994

Printed circuit board with high heat dissipation

Prathap Amerwai Reddy; Kenneth Alan Salisbury; Jay Deavis Baker

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