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Cuong Van Pham

Ford Motor Company

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Publication

Featured researches published by Cuong Van Pham.

Archive | 1996

Ultrasonic flip chip bonding process and apparatus

Cuong Van Pham; Brian John Hayden; Bethany Joy Walles

Archive | 1994

Method for fabricating an undercoated chip electrically interconnected to a substrate

Jay Deavis Baker; Cuong Van Pham; Robert Edward Belke

Archive | 1997

Three-dimensional molded sockets for mechanical and electrical component attachment

Andrew Zachary Glovatsky; Michael George Todd; Cuong Van Pham

Archive | 1994

Ultrasonic flip chip process and apparatus

Cuong Van Pham; Brian John Hayden; Bethany Joy Walles

Archive | 1999

Bonding of semiconductor power devices

Jay Deavis Baker; Brian John Hayden; Cuong Van Pham

Archive | 1998

Method for making an electronic circuit assembly

Vivek Amir Jairazbhoy; Thomas Bernd Krautheim; Mohan R. Paruchuri; Lakhi Nandlal Goenka; Jun Ming Hu; Jay Deavis Baker; Edward P. McLeskey; Delin Li; Cuong Van Pham; Robert Edward Belke

Archive | 1994

Method and apparatus for detecting wire bond pull test failure modes

Cuong Van Pham; Brian John Hayden

Archive | 1997

Moulded sockets for electronic component attachment

Andrew Zachary Glovatsky; Cuong Van Pham; Michael George Todd

Archive | 1997

Method of soldering materials supported on low-melting substrates

Mark Stephen Topping; Cuong Van Pham; Brian John Hayden

Archive | 1997

Method for ultrasonic bonding flexible circuits

Brian John Hayden; Cuong Van Pham; Rosa Lynda Nuno; Mark Stephen Topping

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Collaboration

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Brian John Hayden

Ford Motor Company

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Bethany Joy Walles

Ford Motor Company

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Jay Deavis Baker

Ford Motor Company

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Vivek Amir Jairazbhoy

Ford Motor Company

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Michael George Todd

Ford Motor Company

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Mark Stephen Topping

Ford Motor Company

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Mohan R. Paruchuri

Ford Motor Company

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Andrew Zachary Glovatsky

Ford Motor Company

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Prathap Amervai Reddy

Visteon

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Robert Edward Belke

Ford Motor Company

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