Jay Mathews

Integration of silicon bench micro-optics

Silicon v-groove structures have been utilized for passive positioning of optical fiber for fiber optic and opto- electronic applications. In this paper, we will present our results of using micro-machined silicon v-groove arrays to passively align optical fiber arrays to micro rod optics. We will also demonstrate the integration of N fiber arrays bonded into the silicon v-groove with a 1xN micro lens array, which is composed of a 2 inch-phase level diffractive optics. For the assembly of 1x6 fiber array and lens array with 16 phase level diffractive optics, the experimental results indicated that total insertion loss per link is typically 1.5-2.0 dB/channel.

Development of internal wavelength lockers for tunable laser applications

For telecommunications applications, particularly for WDM and DWDM, tunable lasers are deemed as a viable cost reduction for system and service providers. To lock tunable lasers onto the ITU (Intemational Telecommunications Union) grid, wavelength lockers are required. Intemal wavelength lockers are attractive to the tunable laser manufacturers because they reduce overall laser package size. In this paper, the authors will present several generations of intemal wavelength lockers developed at Digital Optics Corporation (DOC) which include etalon based and nonetalon based front WavesetterTM lockers and back Wavesetter lockers, and a Passively Aligned Wavesetter (PAWSTM) locker module. These Wavesetter wavelength lockers are designed for widely tunable, narrowly tunable and fixed wavelength lasers for channel spacing of 100 GHz, 50 GHz, 25 GHz, and arbitrav spacing (the PAWS locker module). DOC implemented its Photonic ChipTM integrated optics platform for the design and manufacture of these Wavesetter wavelength lockers, which feature compact size and low manufacturing cost through higher levels of integration. In this paper, we present results from design, simulation. fabrication, and testing of these different generations of wavelength lockers.

Micromachined silicon structures for single-mode passive alignment

Penetration into the fiber-in-the-loop (FITL) and fiber-to-the-curb (FTTC) markets requires a drastic cost reduction in optoelectronic packaging. To achieve this goal, passive alignment techniques were developed using micromachined silicon waferboard technology which showed great potential for the tight tolerances (plus or minus 0.5 micrometers) required to passively align optoelectronic devices to single mode fibers. In this technology, micromachined alignment pedestals and standoffs precisely locate the x, y, and z positions of optoelectronic devices, which have matching alignment notches, to the optical fiber confined by a v-groove. The tight tolerances are possible using precision photolithography and well controlled reactive ion etching (RIE). In this paper, we report our process development results of forming micromachined silicon alignment pedestals using RIE. We demonstrate RIE etch depth control for the 6 micrometer z-standoffs with a 0.13 micrometer standard deviation and etch profile control for the x and y alignment pedestals to within 0.25 micrometers for each edge, which were obtained across a 3-inch wafer and from run to run. Such high precision control on RIE etch profile and uniformity is extremely important in developing manufacturable processes.

Packaging of integrated micro optical systems

Wafer scale manufacturing techniques for making both multi-phase level diffractive optics and micro refractive optics feature low manufacturing cost, compact size, and light weight. The integration of the micro optics with lasers, detectors, and optical waveguides enables many new applications where size, weight, and cost are crucial. In this paper, we will report our results on the integrated micro optical systems (IMOS) which contain VCSEL array, detector array, edge emitting lasers, and fiber array for opto-electronic and fiber optic applications.

Integrated micro-optical assemblies for optical interconnects

Integrated micro-optical systems (IMOS) are integrated assemblies of multiple optical components that are made and assembled at the wafer level using semiconductor processing techniques. IMOS has been used to create 3-dimensional optical systems in a cost-effective highly manufacturable manner. Collimated lens arrays have been fabricated with experimental total round trip insertion loss of 1.5-2.0 dB per channel.

Single-mode bi-directional links for fiber-in-the-loop and optical networks

This paper is a review of the present status of an ARPA sponsored program to develop low cost serial links. In particular, this team has focused its efforts on the development of bi-directional links which offer the special feature of sending information in both directions over a single fiber in order to eliminate half the cost of the fiber hardware in the network. Furthermore, this program leverages on the portfolio of technologies provided by the team members to provide a demonstration of a new design for the modules and a new way of manufacturing the modules in order to substantially reduce cost. Team member AMP Incorporated provides manufacturing methods for silicon waferboard assembly, connectors and packaging, Digital Optics provides novel holograms for a bi-directional optic as well as high speed ASIC design, GTE Laboratories provides advice on network requirements and silicon waferboard technology invented at GTE, BroadBand Technologies provides customer input for module requirements for their Digital Flex network for fiber-in-the-loop, the University of Colorado provides modeling for the modules and software for computer integrated manufacturing, Lasertron provides coolerless semiconductor laser die suitable for passive alignment, and Write Laboratories provides oversight and advice on behalf of ARPA.