Jean-Pierre Giacalone

Open multimedia application platform: enabling multimedia applications in third generation wireless terminals through a combined RISC/DSP architecture

Describes how multimedia applications will be enabled in 3G wireless terminals thanks to the efficiency of the DSP core embedded in the TI Open Multimedia Application Platform (OMAP). The OMAP H/W architecture is described, with an emphasis on how multimedia applications (video, audio, speech) will benefit from this advanced architecture. The paper also depicts the advantages provided by a combined RISC/DSP architecture, compared to a single RISC architecture, for 3G multimedia mobile applications.

Enabling video processing in wireless terminals with a new open multimedia application platform

To enable video applications in wireless mobile phones, Texas Instruments (TI) introduces a new open multimedia application platform. This platform will deliver the advanced processing required to make video functions a reality, without compromising the power efficiency essential to wireless communications devices. The paper describes the open multimedia application platform architecture, emphasizing its strength for video applications. The DSP core used in this platform is then detailed, with a special focus on new instructions provided by this new processor, which are especially suited to improve video processing algorithm execution.

Enabling multimedia applications in 2.5G and 3G wireless terminals through a combined RISC/DSP architecture: OMAP

This paper describes how multimedia applications will be enabled in 2.5 and 3G wireless terminals thanks to the efficiency of the DSP core embedded in the TI OMAP platform. OMAP H/W architecture will be described with an emphasis on how multimedia applications (video, audio, speech) will benefit from this advanced architecture. The advantages provided by a combined RISC/DSP architecture, compared to a single RISC architecture, for multimedia mobile applications will be depicted.ZusammenfassungDer vorliegende Beitrag zeigt, wie die neue OMAP-Plattform von Texas Instruments, die einen DSP-Kern aufweist, multimediale Anwendungen in 2.5G- und 3G-Mobiltelefonen unterstützt. Die Autoren beschreiben die OMAP-Hardwarearchitektur und zeigen, wie zum Beispiel Video-, Audio- und Sprachanwendungen von dieser neuartigen Architektur profitieren. Die Vorzüge einer kombinierten RISC/DSP-Architektur im Vergleich zu einer reinen RISC-Architektur werden eingehend diskutiert.