Jingtao Zhao

Theoretical model of the polarization Coulomb field scattering in strained AlGaN/AlN/GaN heterostructure field-effect transistors

The theoretical model of the polarization Coulomb field scattering (PCF) caused by the polarization charge density variation at the AlGaN/AlN interface in strained AlGaN/AlN/GaN heterostructure field-effect transistors has been developed. And the theoretical values for the electron drift mobility, which were calculated using the Matthiessens rule that includes PCF, piezoelectric scattering, polar optical-phonon scattering, and interface roughness scattering, are in good agreement with our experimental values. Therefore, the theoretical model for PCF has been confirmed.

Effect of Polarization Coulomb Field Scattering on Parasitic Source Access Resistance and Extrinsic Transconductance in AlGaN/GaN Heterostructure FETs

With the measured parasitic source access resistance under a different forward gate-source current for the AlGaN/GaN heterostructure FETs (HFETs) with different device sizes, the variation of the measured parasitic source access resistance with the polarization charge distribution at the AlGaN/GaN interface was compared and analyzed. It is found that the variation of the parasitic source access resistance originates from the polarization Coulomb field (PCF) scattering, and the effect of PCF scattering on the parasitic source access resistance is more significant for the device with a longer gate length or a shorter gate-source distance. The behaviors of the measured extrinsic transconductance for the fabricated AlGaN/GaN HFETs confirm the effect of PCF scattering. The possibility is demonstrated to take advantage of this effect to improve the performance of AlGaN/GaN HFETs.

Effects of rapid thermal annealing on the electrical properties of the AlGaN/AlN/GaN heterostructure field-effect transistors with Ti/Al/Ni/Au gate electrodes

In this study, we investigated the electrical properties of the AlGaN/AlN/GaN heterostructure field-effect transistors (HFETs) with Ti/Al/Ni/Au gate electrodes using the measured capacitance-voltage, current-voltage characteristics, and micro-Raman spectroscopy. We found that the uneven distribution of the strain caused by the Schottky metals was a major factor that generates the polarization Coulomb field scattering in AlGaN/AlN/GaN HFETs, and after appropriate rapid thermal annealing (RTA) processes, the polarization Coulomb field scattering was greatly weakened and the two-dimensional electron gas electron mobility was improved. We also found that the Schottky barrier height and the DC characteristics of the devices became better after appropriate RTA. Of course, the electrical performances mentioned above became deteriorated after excessive annealing.

A study of the impact of gate metals on the performance of AlGaN/AlN/GaN heterostructure field-effect transistors

The fabrication processes of heterostructure field-effect transistors (HFETs) often introduce stresses into the device structures. These stresses can significantly affect the electrical characteristics of the device. We investigated the additional strain induced by the gate metals (in this study, Au, Cu, Fe, Al, and Ni) in AlGaN/AlN/GaN HFETs using the measured capacitance-voltage and current-voltage characteristics. We found that the intensity of the additional strain of the AlGaN barrier layer is greatly affected by the types of gate metals. For those metals that mainly undergo a physical interaction with the AlGaN barrier layer, there is a negative correlation between the intensity of the additional strain and the Youngs modulus of the gate metal. Therefore, the gate metal with a larger Youngs modulus will be more favorable for weakening polarization Coulomb field scattering and increasing both the carrier mobility and the sheet carrier density in AlGaN/AlN/GaN HFETs.

Analysis of interface trap states in InAlN/AlN/GaN heterostructures

Gate-source frequency-dependent capacitance and conductance measurements were performed on the In0.17Al0.83N/AlN/GaN heterostructure field-effect transistor with side-Ohmic contacts to study the characteristics of trap states at the interface between InAlN and GaN. The values of interface trap state density and time constant were determined to be (0.96–3.36) × 1013 cm−2 eV−1 and (0.29–1.61) μs, respectively. We calculated the strain in the InAlN barrier layer under the gate and found that the InAlN barrier layer was compressively strained with the in-plane strain of 1.31%. This is a possible reason for such a high interface trap state density which is not as low as supposed in the lattice-matched heterostructures.

Effect of the side-Ohmic contact processing on the polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors

Using the measured capacitance—voltage and current—voltage characteristics of the rectangular AlN/GaN heterostructure field-effect transistors (HFETs) with the side-Ohmic contacts, it was found that the polarization Coulomb field scattering in the AlN/GaN HFETs was greatly weakened after the side-Ohmic contact processing, however, it still could not be ignored. It was also found that, with side-Ohmic contacts, the polarization Coulomb field scattering was much stronger in AlN/GaN HFETs than in AlGaN/AlN/GaN and In0.17Al0.83N/AlN/GaN HFETs, which was attributed to the extremely thinner barrier layer and the stronger polarization of the AlN/GaN heterostructure.

The influence of the AlN barrier thickness on the polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors

The electron mobility scattering mechanisms in AlN/GaN heterostuctures with 3 nm and 6 nm AlN barrier thicknesses were investigated by temperature-dependent Hall measurements. The effect of interface roughness (IFR) scattering on the electron mobility was found to be enhanced by increasing AlN barrier thickness. Moreover, using the measured capacitance-voltage and current-voltage characteristics of the fabricated heterostructure field-effect transistors (HFETs) with different Schottky areas on the two heterostuctures, the variations of electron mobility with different gate biases were investigated. Due to enhanced IFR scattering, the influence of polarization Coulomb field (PCF) scattering on electron mobility was found to decrease with increasing AlN barrier layer thickness. However, the PCF scattering remained an important scattering mechanism in the AlN/GaN HFETs.

Influence of the gate position on source-to-drain resistance in AlGaN/AlN/GaN heterostructure field-effect transistors

Using a suitable dual-gate structure, the source-to-drain resistance (RSD) of AlGaN/AlN/GaN heterostructure field-effect transistor (HFET) with varying gate position has been studied at room temperature. The theoretical and experimental results have revealed a dependence of RSD on the gate position. The variation of RSD with the gate position is found to stem from the polarization Coulomb field (PCF) scattering. This finding is of great benefit to the optimization of the performance of AlGaN/AlN/GaN HFET. Especially, when the AlGaN/AlN/GaN HFET works as a microwave device, it is beneficial to achieve the impedance matching by designing the appropriate gate position based on PCF scattering.