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Joe W. Zhao

LSI Corporation

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Publication

Featured researches published by Joe W. Zhao.

Archive | 1999

Plasma cleaning process for openings formed in at least one low dielectric constant insulation layer over copper metallization in integrated circuit structures

Joe W. Zhao; Wei-jen Hsia; Wilbur G. Catabay

Archive | 1999

Process for treating damaged surfaces of low dielectric constant organo silicon oxide insulation material to inhibit moisture absorption

Zhihai Wang; Wilbur G. Catabay; Joe W. Zhao

Archive | 1999

Process to prevent stress cracking of dielectric films on semiconductor wafers

Wilbur G. Catabay; Wei-jen Hsia; Joe W. Zhao

Archive | 1996

Plasma clean with hydrogen gas

Joe W. Zhao; Zhihai Wang; Wilbur G. Catabay

Archive | 1997

Consistent alignment mark profiles on semiconductor wafers using PVD shadowing

Joe W. Zhao; Wilbur G. Catabay; Shumay X. Dou

Archive | 1996

Method of making a barrier layer for via or contact opening of integrated circuit structure

Joe W. Zhao; Zhihai Wang; Wilbur G. Catabay

Archive | 1998

Method to obtain a low resistivity and conformity chemical vapor deposition titanium film

Joe W. Zhao; Wei-jen Hsia; Wilbur G. Catabay

Archive | 1997

Metal-filled via/contact opening with thin barrier layers in integrated circuit structure for fast response, and process for making same

Joe W. Zhao; Wilbur G. Catabay

Archive | 1995

Method for improvement of TiN CVD film quality

Joe W. Zhao; Wilbur G. Catabay

Archive | 1999

Low dielectric constant silicon oxide-based dielectric layer for integrated circuit structures having improved compatibility with via filler materials, and method of making same

Wilbur G. Catabay; Wei-jen Hsia; Weidan Li; Joe W. Zhao

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Wilbur G. Catabay

LSI Corporation

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Wei-jen Hsia

LSI Corporation

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Zhihai Wang

LSI Corporation

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Mark I. Mayeda

LSI Corporation

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Shumay X. Dou

LSI Corporation

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Weidan Li

LSI Corporation

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