Johannes Etzkorn
Atotech
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Publication
Featured researches published by Johannes Etzkorn.
SID Symposium Digest of Technical Papers | 2011
Simon Bamberg; Birgit Beck; Horst Brüggmann; Frank Brüning; Elisa Langhammer; Christian Lowinski; Michael Merschky; Jörg Schulze; Johannes Etzkorn
Recently the use of Copper as a conductor material for Thin Film Transistor (TFT) structures has received increasing attention in the Flat Panel Display industry [1, 2]. Since sputtering of thick Cu layers has serious disadvantages Flat Panel Display (FPD) manufacturers are considering wet chemical Cu deposition as a viable process alternative. Depending on the required film properties like conductivity and surface roughness either electroless or electrolytical Copper deposition can be applied.
Intermetallics | 2008
Bernhard Gollas; Jörg H. Albering; Katharina Schmut; Volker Pointner; Ralph Herber; Johannes Etzkorn
Thin Solid Films | 2011
Ralf Brüning; Bruce Muir; Eric McCalla; Émilie Lempereur; Frank Brüning; Johannes Etzkorn
Archive | 2007
Ralph Herber; Olaf Kurtz; Johannes Etzkorn; Christian Madry; Carsten Schwiekendick; Gerd Schäfer
Archive | 2014
Frank Brüning; Elisa Langhammer; Michael Merschky; Christian Lowinski; Jörg Schulze; Johannes Etzkorn; Birgit Beck
Journal of The Electrochemical Society | 2013
Tanu Sharma; Ralf Brüning; Colby Brown; Allison Sibley; Johannes Etzkorn; Lutz Stamp
Archive | 2006
Heinrich Meyer; Olaf Kurtz; Ralph Herber; Christian Madry; Johannes Etzkorn; Thomas Vago
Archive | 2005
Johannes Etzkorn; Ralph Herber; Olaf Kurtz; Christian Madry; Heinrich Meyer; Thomas Vago
Archive | 2008
Ralph Herber; Olaf Kurtz; Johannes Etzkorn; Christian Madry; Carsten Schwiekendick; Gerd Schäfer
Archive | 2011
Frank Brüning; Birgit Beck; Bexy Dosse; Johannes Etzkorn
