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Dive into the research topics where Frank Brüning is active.

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Featured researches published by Frank Brüning.


SID Symposium Digest of Technical Papers | 2011

P-66: Wet Chemical Metallization for High-End Flat Panel Display Manufacturing

Simon Bamberg; Birgit Beck; Horst Brüggmann; Frank Brüning; Elisa Langhammer; Christian Lowinski; Michael Merschky; Jörg Schulze; Johannes Etzkorn

Recently the use of Copper as a conductor material for Thin Film Transistor (TFT) structures has received increasing attention in the Flat Panel Display industry [1, 2]. Since sputtering of thick Cu layers has serious disadvantages Flat Panel Display (FPD) manufacturers are considering wet chemical Cu deposition as a viable process alternative. Depending on the required film properties like conductivity and surface roughness either electroless or electrolytical Copper deposition can be applied.


Thin Solid Films | 2011

Strain in electroless copper films monitored by X-ray diffraction during and after deposition and its dependence on bath chemistry

Ralf Brüning; Bruce Muir; Eric McCalla; Émilie Lempereur; Frank Brüning; Johannes Etzkorn


Thin Solid Films | 2012

The effect of nickel on the strain evolution in chemical copper films

Simon Bamberg; Laura K. Perry; Bruce Muir; Alaaedeen Abuzir; Frank Brüning; Ralf Brüning


Thin Solid Films | 2014

Stress of electroless copper deposits on insulating and metal substrates

Ralf Brüning; Allison Sibley; Tanu Sharma; Delilah A. Brown; Thibault Demay; Frank Brüning; Tobias Bernhard


Archive | 2013

Method for manufacture of fine line circuitry

Richard Nichols; Don Jang; Harald Riebel; Frank Brüning


Archive | 2013

COMPOSITION FOR FORMING A SEED LAYER

Richard Dixon; Jose Pedrosa; Daniel Johnson; Jörg Schulze; Matthias Dammasch; Dave Baron; Frank Brüning; Robin Taylor


Microelectronic Engineering | 2015

Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

Tanu Sharma; Ralf Brüning; Tang Cam Lai Nguyen; Tobias Bernhard; Frank Brüning


Archive | 2014

Electroless copper plating solution

Frank Brüning; Elisa Langhammer; Michael Merschky; Christian Lowinski; Jörg Schulze; Johannes Etzkorn; Birgit Beck


International Symposium on Microelectronics | 2013

Analysis of stress/strain in Electroless Copper Films

Tobias Bernhard; Simon Bamberg; Frank Brüning; Ralf Brüning; Laurence J. Gregoriades; Tanu Sharma; Delilah A. Brown; M. Klaus; Ch. Genzel


MRS Proceedings | 2012

Strain Analysis of Copper Films During Wet-Chemical Deposition.

Ralf Brüning; Laura K. Perry; Bruce Muir; Alaaedeen Abuzir; Simon Bamberg; Wolfgang Friz; Nina Dambrowsky; Frank Brüning

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Ralf Brüning

Mount Allison University

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Tanu Sharma

Mount Allison University

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Michael Merschky

Technical University of Berlin

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