John Charles Duda
Seagate Technology
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Publication
Featured researches published by John Charles Duda.
Nanoscale and Microscale Thermophysical Engineering | 2015
Li Shi; Chris Dames; Jenifer R. Lukes; Pramod Reddy; John Charles Duda; David G. Cahill; Jaeho Lee; Amy Marconnet; Kenneth E. Goodson; Je-Hyeong Bahk; Ali Shakouri; Ravi Prasher; Jonathan R. Felts; William P. King; Bumsoo Han; John C. Bischof
The past two decades have witnessed the emergence and rapid growth of the research field of nanoscale thermal transport. Much of the work in this field has been fundamental studies that have explored the mechanisms of heat transport in nanoscale films, wires, particles, interfaces, and channels. However, in recent years there has been an increasing emphasis on utilizing the fundamental knowledge gained toward understanding and improving device and system performances. In this opinion article, an attempt is made to provide an evaluation of the existing and potential impacts of the basic research efforts in this field on the developments of the heat transfer discipline, workforce, and a number of technologies, including heat-assisted magnetic recording, phase change memories, thermal management of microelectronics, thermoelectric energy conversion, thermal energy storage, building and vehicle heating and cooling, manufacturing, and biomedical devices. The goal is to identify successful examples, significant challenges, and potential opportunities where thermal science research in nanoscale has been or will be a game changer.
IEEE Transactions on Magnetics | 2017
James Dillon Kiely; Paul M. Jones; Yang Yang; John L. Brand; Manuel Charles Anaya-Dufresne; Patrick Carl Fletcher; Florin Zavaliche; Yvete Toivola; John Charles Duda; Michael Thomas Johnson
One detrimental by-product of heat-assisted magnetic recording writing is the creation of head contamination. Here, we present the current understanding of the driving forces, growth mechanisms, and growth rates of write-induced head contamination. The combination of an evaporation and condensation model with shear forces suggests a flow of lubricant on the head may precipitate contamination. The contamination is observed to grow in the head–media gap until it contacts the media surface, at which point an additional material pickup mechanism can be activated. Evidence of contact-induced transfer and a chemical reaction of the contamination is presented, and the impacts of contamination on head temperatures and thermal gradient is presented. Depending on the contamination properties, head temperatures may be increased substantially, leading to increased reliability risk. Consistent with previous analyses, we find that contamination may increase media thermal gradient.
Archive | 2016
Weibin Chen; Martin Blaber; Tong Zhao; Michael Christopher Kautzky; John Charles Duda
Archive | 2016
Martin Blaber; Michael Allen Seigler; Michael Christopher Kautzky; Tong Zhao; Justin Brons; John Charles Duda; Yuhang Cheng
Archive | 2016
John Charles Duda; Ruoxi Yang; James Gary Wessel
Archive | 2016
John Charles Duda; James Gary Wessel
Archive | 2015
Tong Zhao; John Charles Duda; Michael Christopher Kautzky
Archive | 2016
Martin Blaber; Tong Zhao; Michael Christopher Kautzky; Justin Brons; John Charles Duda; Yuhang Cheng; Michael Allen Seigler
Archive | 2014
Zoran Jandric; Chris Rea; Pierre Asselin; Michael Thomas Johnson; Manuel Charles Anaya-Dufresne; John Charles Duda
Archive | 2016
Yuhang Cheng; Scott Franzen; Michael Allen Seigler; James Gary Wessel; Tong Zhao; John Charles Duda; Sarbeswar Sahoo; Hui Brickner; Michael Christopher Kautzky