John Dell

Scattering mechanisms limiting two-dimensional electron gas mobility in Al0.25Ga0.75N/GaN modulation-doped field-effect transistors

In order to characterize the electron transport properties of the two-dimensional electron gas (2DEG) in AlGaN/GaN modulation-doped field-effect transistors, channel magnetoresistance has been measured in the magnetic field range of 0–12 T, the temperature range of 25–300 K, and gate bias range of +0.5 to −2.0 V. By assuming that the 2DEG provides the dominant contribution to the total conductivity, a one-carrier fitting procedure has been applied to extract the electron mobility and carrier sheet density at each particular value of temperature and gate bias. Consequently, the electron mobility versus 2DEG sheet density has been obtained for each measurement temperature. Theoretical analysis of these results suggests that for 2DEG densities below 7×1012 cm−2, the electron mobility in these devices is limited by interface charge, whereas for densities above this level, electron mobility is dominated by scattering associated with the AlGaN/GaN interface roughness.

Widely Tunable MEMS-Based Fabry–Perot Filter

This paper describes the use of strain stiffening in fixed-fixed beam actuators to extend the tuning range of microelectromechanical-systems-based Fabry-Perot filters. The measured wavelength tuning range of 1.615-2.425 mum is the largest reported for such a filter. Curvature in the movable mirror was corrected using a low-power oxygen plasma to controllably alter the stress gradient in the mirror. After curvature correction, the linewidth of a filter was 52 nm, close to the theoretical minimum for our mirror design. As a proof of concept, a filter was bonded to a broadband infrared detector, realizing a wavelength-tunable infrared detector. All measured data have been compared to theoretical models of the optics and mechanics of the filters, with excellent agreement between theory and measurement demonstrated in all cases. Finally, the Youngs modulus and stress of the actuator materials were extracted directly from the measured voltage-displacement curves, demonstrating a novel technique for material property measurement.

Monolithic integration of an infrared photon detector with a MEMS-based tunable filter

The monolithic integration of a low-temperature microelectromechanical system (MEMS) and HgCdTe infrared detector technology has been implemented and characterized. The MEMS-based tunable optical filter, integrated with an infrared detector, selects narrow wavelength bands in the range from 1.6 to 2.5 /spl mu/m within the short-wavelength infrared (SWIR) region of the electromagnetic spectrum. The entire fabrication process is compatible with two-dimensional infrared focal plane array technology. The fabricated device consists of an HgCdTe SWIR photoconductor, two distributed Bragg mirrors formed of Ge-SiO-Ge, a sacrificial spacer layer within the cavity, which is then removed to leave an air gap, and a silicon nitride membrane for structural support. The tuning spectrum from fabricated MEMS filters on photoconductive detectors shows a wide tuning range, and high percentage transmission is achieved with a tuning voltage of only 7.5 V. The full-width at half-maximum ranged from 95 to 105 nm over a tuning range of 2.2-1.85 /spl mu/m.

/sup 60/Co gamma irradiation effects on n-GaN Schottky diodes

The effect of /spl gamma/-ray exposure on the electrical characteristics of nickel/n-GaN Schottky barrier diodes has been investigated using current-voltage (I-V), capacitance-voltage (C-V), and deep-level transient spectroscopy (DLTS) measurements. The results indicate that /spl gamma/-irradiation induces an increase in the effective Schottky barrier height extracted from C-V measurements. Increasing radiation dose was found to degrade the reverse leakage current, whereas its effect on the forward I-V characteristics was negligible. Low temperature (/spl les/50) post-irradiation annealing after a cumulative irradiation dose of 21 Mrad(Si) was found to restore the reverse I-V characteristics to pre-irradiation levels without significantly affecting the radiation-induced changes in C-V and forward I-V characteristics. Three shallow radiation-induced defect centers with thermal activation energies of 88 104 and 144 meV were detected by DLTS with a combined production rate of 2.12 /spl times/ 10/sup -3/ cm/sup -1/. These centers are likely to be related to nitrogen-vacancies. The effect of high-energy radiation exposure on device characteristics is discussed taking into account possible contact inhomogeneities arising from dislocations and interfacial defects. The DLTS results indicate that GaN has an intrinsically low susceptibility to radiation-induced material degradation, yet the effects observed in the Schottky diode I-V and C-V characteristics indicate that the total-dose radiation hardness of GaN devices may be limited by susceptibility of the metal-GaN interface to radiation-induced damage.

Determination of mechanical properties of PECVD silicon nitride thin films for tunable MEMS Fabry–Pérot optical filters

This paper reports an investigation on techniques for determining elastic modulus and intrinsic stress gradient in plasma-enhanced chemical vapor deposition (PECVD) silicon nitride thin films. The elastic property of the silicon nitride thin films was determined using the nanoindentation method on silicon nitride/silicon bilayer systems. A simple empirical formula was developed to deconvolute the film elastic modulus. The intrinsic stress gradient in the films was determined by using micrometric cantilever beams, cross-membrane structures and mechanical simulation. The deflections of the silicon nitride thin film cantilever beams and cross-membranes caused by in-thickness stress gradients were measured using optical interference microscopy. Finite-element beam models were built to compute the deflection induced by the stress gradient. Matching the deflection computed under a given gradient with that measured experimentally on fabricated samples allows the stress gradient of the PECVD silicon nitride thin films introduced from the fabrication process to be evaluated.

MEMS-based microspectrometer technologies for NIR and MIR wavelengths

Commercially manufactured near-infrared (NIR) instruments became available about 50 years ago. While they have been designed for laboratory use in a controlled environment and boast high performance, they are generally bulky, fragile and maintenance intensive, and therefore expensive to purchase and maintain.Micromachining is a powerful technique to fabricate micromechanical parts such as integrated circuits. It was perfected in the 1980s and led to the invention of micro electro mechanical systems (MEMSs). The three characteristic features of MEMS fabrication technologies are miniaturization, multiplicity and microelectronics. Combined, these features allow the batch production of compact and rugged devices with integrated intelligence. In order to build more compact, more rugged and less expensive NIR instruments, MEMS technology has been successfully integrated into a range of new devices.In the first part of this paper we discuss the UWA MEMS-based Fabry–Perot spectrometer, its design and issues to be solved. MEMS-based Fabry–Perot filters primarily isolate certain wavelengths by sweeping across an incident spectrum and the resulting monochromatic signal is detected by a broadband detector. In the second part, we discuss other microspectrometers including other Fabry–Perot spectrometer designs, time multiplexing devices and mixed time/space multiplexing devices.

MAGNETIC FIELD DEPENDENT HALL DATA ANALYSIS OF ELECTRON TRANSPORT IN MODULATION-DOPED ALGAN/GAN HETEROSTRUCTURES

Experimental magnetic field dependent Hall and resistivity data is presented for two modulation-doped AlGaN/GaN heterostructures in the temperature range from 6 to 300 K and for a magnetic field up to 12 T. The mobility and concentration of electrons within the two-dimensional electron gas (2DEG) at the AlGaN/GaN interface and within the underlying GaN layer are readily separated and characterized using quantitative mobility spectrum analysis. The observed transport parameters of the 2DEG are explained using the classical band theory for a degenerate electron gas. Analysis of the temperature dependencies of mobility and electron concentration in the GaN layer and 2DEG indicates that electron transport in the GaN layer is dominated by carriers in the conduction band for the case of low-doping ( 1018 cm−3). The simultaneous analysis of the multilayer AlGaN/GaN structure applied in this work renders the results applicable directly...

Generation-recombination effects on dark currents in CdTe-passivated midwave infrared HgCdTe photodiodes

The effect of an abrupt CdTe∕HgCdTe passivation heterointerface on generation recombination and dark currents in n-on-p midwave infrared photodiodes with 5.2-μm cut-off wavelength has been investigated. Experimentally, it was observed that the zero-bias-dynamic resistance, R0, at low temperatures scales with the perimeter of the n-on-p junction, rather than with the junction area, suggesting that surface effects are dominant. The diode current–voltage characteristics at low temperatures indicate significant contributions from tunneling effects, which is the dominant leakage current mechanism for reverse bias greater than approximately 30mV. These two observations suggest that the region where the junction terminates at the CdTe∕HgCdTe abrupt interface is responsible for the above effects. A two-dimensional model has been developed to investigate the dark current mechanisms in the vicinity of the junction termination at CdTe∕HgCdTe interface, which also takes into account the effect of dislocations on gene...

Interpretation of current flow in photodiode structures using laser beam-induced current for characterization and diagnostics

This paper presents an interpretation of the physical mechanisms involved in the generation of laser beam-induced current (LBIC) in semiconductor p-n junction diodes. LBIC is a nondestructive semiconductor characterization technique that has been used in a qualitative manner for a number of years and is especially useful for examining individual photodiodes within large two-dimensional arrays of devices. The main thrust of this work is the analysis of LBIC in terms of nonzero steady-state circulatory current flow within the device and, hence, the interpretation of LBIC line profiles to diagnose the patterns of current flow within the structure. This provides an important basis for future studies seeking to relate LBIC to indicators of p-n junction performance and integrity such as dark current components and reverse bias saturation current. In particular, this paper examines the ideal cases of a single isolated p-n junction diode structure, and also considers an array of such devices in close proximity to each other. Modifications to the idealized theory that are required to account for localized junction leakage and surface recombination are presented, and the effect of Schottky contacts is discussed. Numerical simulations based on the HgCdTe family of semiconductors are presented to support the theory.

Stress in low-temperature plasma enhanced chemical vapour deposited silicon nitride thin films

Two experimental techniques have been investigated to examine residual stress in low-temperature plasma enhanced chemical vapour deposited (PECVD) SiNx thin films: one that measures the stress-induced substrate curvature, and the other that takes advantage of the stress-induced deformation of freestanding diagnostic microstructures. A general linear dependence of residual stress on SiNx deposition temperature is observed, with the magnitude of stress changing linearly from ~300 MPa tensile stress to ~600 MPa compressive stress as the deposition temperature is decreased from 300 to 100 °C. However, the results deviate from the linear dependence by a different degree for both measurement techniques at low deposition temperatures. The stress values obtained via the substrate curvature method deviate from the linear dependence for deposition temperatures below 200 °C, whereas the values obtained via the diagnostic microstructures method deviate from the linear dependence for deposition temperatures below 100 °C. Stress uniformity over the deposition area is also investigated.