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Digest of Literature on Dielectrics Volume 28 1964 | 1964

Chapter IV: Conduction phenomena in dielectric solids

Oliver H. LeBlanc; John H. Lupinski; Charles M. Huggins

One of the prerogatives of the authors of any review is the choice of emphasis on those subjects in which the authors are particularly interested. The material covered here reflects, to some extent, just such a preference. The sheer quantity of literature published during the year 1964 which could be included under this general title precludes any completely general coverage in a reasonable-sized review. Hence, a selection was based upon a supposition on the interests of the readers of this volume. On this basis, the strongest interest was centered on materials generally considered as dielectrics and on theory most applicable to dielectric materials. The metals, as well as some other materials exhibiting metallic-like behavior, were in general not included. Likewise, no coverage was extended to the so-called wide-band semiconductors such as silicon and germanium on the assumption that adequate coverage of this subject is a separate work to be found in other sources. The intermetallic semiconductors were excluded on the same principle.


Archive | 1978

Bonded amorphous metal electromagnetic components

John H. Lupinski


Archive | 1966

Electronically conductive polymeric compositions

John H. Lupinski; Jerome J Hertz


Archive | 1992

Plasticized polyetherimide adhesive composition and usage

John H. Lupinski; Theresa Ann Sitnik; Thomas Bert Gorczyca; Steven Thomas Rice; Herbert Stanley Cole


Archive | 1988

Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production

Erik Wilhelm Walles; John H. Lupinski; Mark Markovitz; Robert Edgar Colborn; James Robert Presley; Michael John Davis; Michael Gerald Minnick; Steven J. Kubisen; John E. Hallgren; Donald Allen Bolon; Victoria J. Eddy; Patricia Chapman Irwin


Journal of Polymer Science Part C: Polymer Symposia | 2007

New class of film‐forming electrically conducting polymers

John H. Lupinski; K. D. Kopple; J. J. Hertz


Archive | 1991

Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators

Erik Wilhelm Walles; John H. Lupinski; James V. Crivello


Archive | 1989

Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether

Erik Wilhelm Walles; John H. Lupinski; Mark Markovitz; Robert Edgar Colborn; James Robert Presley; Michael John Davis; Michael Gerald Minnick; Steven J. Kubisen; John E. Hallgren; Donald Allen Bolon; Victoria J. Eddy; Patricia Chapman Irwin


Archive | 2008

Flame Retardant Polycarbonate Compositions

John H. Lupinski; Christopher Michael Hawkins


Archive | 1974

Method for making polyimide coated conductors in a continuous manner and products made thereby

John H. Lupinski; James M. Mcquade

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