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Erik Wilhelm Walles

General Electric

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Publication

Featured researches published by Erik Wilhelm Walles.

Archive | 1988

Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production

Erik Wilhelm Walles; John H. Lupinski; Mark Markovitz; Robert Edgar Colborn; James Robert Presley; Michael John Davis; Michael Gerald Minnick; Steven J. Kubisen; John E. Hallgren; Donald Allen Bolon; Victoria J. Eddy; Patricia Chapman Irwin

Archive | 1991

Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators

Erik Wilhelm Walles; John H. Lupinski; James V. Crivello

Archive | 1989

Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether

Erik Wilhelm Walles; John H. Lupinski; Mark Markovitz; Robert Edgar Colborn; James Robert Presley; Michael John Davis; Michael Gerald Minnick; Steven J. Kubisen; John E. Hallgren; Donald Allen Bolon; Victoria J. Eddy; Patricia Chapman Irwin

Archive | 1991

Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions

Erik Wilhelm Walles; James V. Crivello; John H. Lupinski

Archive | 1990

Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether

Erik Wilhelm Walles; John H. Lupinski; Mark Markovitz; Robert Edgar Colborn; James Robert Presley; Michael John Davis; Michael Gerald Minnick; Steven J. Kubisen; John E. Hallgren; Donald Allen Bolon; Victoria J. Eddy; Patricia Chapman Irwin

Archive | 1990

Encapsulation method, microelectronic devices made therefrom, and heat curable compositions

Erik Wilhelm Walles; John H. Lupinski; James V. Crivello

Archive | 1993

CURABLE EPOXY RESIN COMPOSITION

Erik Wilhelm Walles; John H. Lupinski; James V. Crivello

Archive | 1989

New Transfer Molding Compounds

Erik Wilhelm Walles; John H. Lupinski; S. Bandes; M. Rosenfield

Archive | 1989

Härtbare Polyphenylenether/Polyepoxid-Zusammensetzung, verwendbar zur Herstellung von Leiterplatten für gedruckte Schaltungen. The curable polyphenylene ether / polyepoxide composition useful for producing printed circuit boards for printed circuits.

John E. Hallgren; Donald Allen Bolon; Victoria J. Eddy; Patricia Chapman Irwin; James Robert Presley; Michael John Davis; Michael Gerald Minnick; Steven J. Kubisen; Erik Wilhelm Walles; John H. Lupinski; Marc Nmn Markovitz; Robert Edgar Colborn

Archive | 1988

Verfahren zum Mikroverkapseln, damit hergestellte mikroelektronische Apparate und wärmehärtbare Zusammensetzungen. A method of microencapsulation, microelectronic devices made therefrom and thermosetting compositions.

Erik Wilhelm Walles; James V. Crivello; John H. Lupinski

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Collaboration

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John H. Lupinski

General Electric

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James V. Crivello

General Electric

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Donald Allen Bolon

General Electric

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James Robert Presley

General Electric

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John E. Hallgren

General Electric

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Michael Gerald Minnick

General Electric

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Michael John Davis

General Electric

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Patricia Chapman Irwin

General Electric

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Robert Edgar Colborn

General Electric

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Steven J. Kubisen

General Electric

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