John M. Bedinger
Raytheon
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Publication
Featured researches published by John M. Bedinger.
international microwave symposium | 2000
John M. Bedinger
Topics discussed in this paper are flip chip and BGA packaging and related assembly issues important in the design of microwave power amplifier and integrated transceiver MMICs. Environmental stress, thermal management, electrical performance, and inspection issues associated with flip chip and ball-grid array packaging will be discussed. The selection of solders, insulating substrates and underfill, will be presented with supporting data for various materials and geometries.
Archive | 2009
John M. Bedinger; Michael A. Moore
Archive | 2008
John M. Bedinger; Michael A. Moore; Robert B. Hallock; Kamal Tabatabaie Alavi; Thomas E. Kazior
Archive | 2009
James S. Mason; John M. Bedinger; Raj Rajendran
Archive | 2009
John M. Bedinger; Michael A. Moore
Archive | 2017
John M. Bedinger; Sankerlingam Rajendran
Archive | 2008
John M. Bedinger; Michael A. Moore; Robert B. Hallock; Kamal Tabatabaie-Alavi; Thomas E. Kazior
Archive | 2008
John M. Bedinger; Michael A. Moore; Robert B. Hallock; Kamal Tabatabaie-Alavi; Thomas E. Kazior
Archive | 2008
John M. Bedinger; Michael A. Moore
Archive | 2008
Michael A. Moore; John M. Bedinger
