John. N. Lalena

Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment

Doped alloys for electrical interconnects, methods of production and uses thereof

Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages

Solder paste formulations, methods of production and uses thereof

Compositions, methods and devices for high temperature lead-free solder

Principles of Inorganic Materials Design: Lalena/Principles of Inorganic Materials Design

Magnetic and Dielectric Properties

Thermal interface materials; and compositions comprising indium and zinc

Improved compositions, methods and devices for high temperature lead-free solder

Metal–Nonmetal Transitions