Martin W. Weiser

Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment

Thermal interconnect and interface materials, methods of production and uses thereof

Doped alloys for electrical interconnects, methods of production and uses thereof

Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages

ANODES FOR ELECTROPLATING OPERATIONS, AND METHODS OF FORMING MATERIALS OVER SEMICONDUCTOR SUBSTRATES

Solder paste formulations, methods of production and uses thereof

Compositions, methods and devices for high temperature lead-free solder

Alpha radiation sources in low alpha materials and implications for low alpha materials refinement

Modified solder alloys for electrical interconnects, mehtods of production and uses thereof

Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials