Jong-heun Lim
Samsung
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Publication
Featured researches published by Jong-heun Lim.
international interconnect technology conference | 2016
Sun-OO Kim; Shannon Dunn; Steven Smith; WenLi Collision; Jamie Prudhomme; Huey-Ming Wang; Joe Maniscalco; Nithin Yathapu; Chulgi Song; Barry Wang; Christopher R. Carr; Hsi-Wen Liu; Bruce Gall; Angelo Alaestante; Min-Hui Chen; Richard Conti; ChungJu Yang; Denis Sullivan; Kosta Culafi; BumKi Moon; Yii-Cheng Lin; Yu-Lieh Fu; Katherine Sieg; Anne-Sophie Larrea; Norman Fish; Regina Swaine; Alexander Bialy; Milo Tallon; Gerard Stapf; John Hagwood
At 450mm wafer area, the first Cu BEOL module process was demonstrated with a single damascene structure using low-k ILD, TiN metal hard mask and guided 20nm half-pitched lamella BCP DSA patterning. It showed the potential opportunities, technical feasibility and further challenges for coming needs for 450mm equipment.
advanced semiconductor manufacturing conference | 2016
Anne-Sophie Larrea; Shannon Dunn; Wenli Collison; Daniel Franca; Christopher L. Borst; Janghee Lee; Jong-heun Lim; Stock Chang
One of the options to reduce the cost related to the next generation of devices in the semiconductor industry is the scale up of the wafer size from 300mm to 450mm. The 450mm transition requires the development and qualification of new tools and processes. G450C, a partnership between five international integrated circuit (IC) makers and CNSE (College of Nanoscale Science and Engineering), has been created to lead this transition. Patterned wafers are necessary to test and demonstrate these 450mm tools. The challenge has been to develop and validate a patterning process — capable of producing advanced-node-relevant features — in a timely manner to enable the process and tool demonstrations. Based on the provided and available 450mm processes and tools, a 28nm pitch STI (Shallow Trench Isolation) structure on a 450mm wafer was developed. This feature was made possible using a 193nm immersion lithography DSA (Directed Self Assembly) technique. This paper will update G450C program status and show process results obtained on 450mm wafers using an STI structure.
Archive | 2011
Hyu-Jung Kim; Sang-Yong Park; Jong-heun Lim; Kyung-Hyun Kim; Chang-Sup Mun
Archive | 2008
Suk-Hun Choi; In-Gyu Baek; Seong-Kyu Yun; Jong-heun Lim; Chagn-Ki Hong; Bo-Un Yoon
Archive | 2012
Hyo-Jung Kim; Daehong Eom; Jong-heun Lim; Myung-Jung Pyo; Byoung-moon Yoon; Kyung-Hyun Kim
Archive | 2005
Jong-heun Lim; Jae-dong Lee; Bo-Un Yoon; Chang-Ki Hong
Archive | 2007
Sang-Yeob Han; Chang-Ki Hong; Bo-Un Yoon; Young-Ho Koh; Seong-Kyu Yun; Jong-heun Lim
Archive | 2012
Jong-heun Lim; Ki-ho Bae; Hyo-Jung Kim; Kyung-hyun Kim; Chan-wook Seo; Youngbeom Pyon
Archive | 2008
Jong-heun Lim; Sung-Ho Shin; Bo-Un Yoon; Chang-ki Hong
Archive | 2013
In-Kwon Kim; Kyung-hyun Kim; Ki-Jong Park; Ki-ho Bae; Jong-heun Lim