Joseph Kuczynski

Thermally conductive dielectrics for insulated metal core cards

Abstract Two thermally conductive dielectrics were evaluated for fabrication of double-sided power regulator cards. Both physical and mechanical properties were determined as a function of temperature and fed into a finite element model. Substrate B, a rubber-modified epoxy, exhibited a lower coefficient of thermal expansion (CTE) and higher T g than substrate A, a cycloaliphatic epoxy dielectric. Substrate A cohesively delaminated following solder shock whereas substrate B exhibited no evidence of cracking. The finite element model correctly predicted the region of highest stress in the cross section of plated through holes of test vehicles built from either substrate.

A dielectric based waveguide integrated in a multilayer PCB for ultra high speed communications

This paper presents an electromagnetic dielectric wave guiding methodology for ultra-high speed signaling in a multilayer PCB environment. Two dielectric materials, one of which has a higher dielectric constant than the other, are embedded between the two ground planes of an internal PCB layer to enable wave propagation. Different transmission properties can be achieved by varying the dimensions or material properties of the dielectric waveguide. PCB integrated dielectric waveguides can achieve wide operating frequencies in the millimeter wave region of the frequency spectrum thus showing potential to push high speed bus designs to faster data rates than is currently possible.

Crosstalk evaluation between ultra high speed multi-layer compatible PCB dielectric waveguides and reduction using split ring resonators

In this paper, the crosstalk between closely spaced ultra-high speed dielectric waveguides is evaluated. The waveguides are operated at frequencies up to 100GHz, while being integrable in commercially available multi-layered printed circuit boards. The cores of the dielectric waveguides have Megtron6-like material properties while the cladding uses Teflon-like material properties. The crosstalk between the waveguides is evaluated for a variety of waveguide dimensions and spacings between waveguides. A novel technique using split ring resonators to reduce crosstalk between waveguides is introduced. The resonators are placed between the waveguides in order to absorb wave leakage which causes crosstalk, resulting in crosstalk reduction.