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Joseph Matthew Harvilchuck

IBM

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Publication

Featured researches published by Joseph Matthew Harvilchuck.

Archive | 1988

High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology

Joseph Louis Horvath; Robert G. Biskeborn; Joseph Matthew Harvilchuck

Archive | 1987

Method and means for co-sintering ceramic/metal mlc substrates

Philip L. Flaitz; Arlyne Marie Flanagan; Joseph Matthew Harvilchuck; Lester Wynn Herron; John U. Knickerbocker; Robert Wolff Nufer; Charles Hampton Perry; Srinivasa S. N. Reddy; Steven P. Young

Archive | 1975

Reactive ion etching of aluminum

Joseph Matthew Harvilchuck; Joseph Skinner Logan; William Clifford Metzger; Paul M. Schaible

Archive | 1990

Method and structure for repairing electrical lines

Edward Frank Handford; Joseph Matthew Harvilchuck; Mario J. Interrante; Raymond A. Jackson; Raj Navinchandra Master; Sudipta K. Ray; William E. Sablinski; Thomas A. Wassick

Archive | 1983

Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby

Donald W. Baudrand; Rebecca P. Fleming; John J. Gniewek; Joseph Matthew Harvilchuck; Arnold F. Schmeckenbecher

Archive | 1992

Structure for repairing electrical lines

Edward Frank Handford; Joseph Matthew Harvilchuck; Mario J. Interrante; Raymond A. Jackson; Raj Navinchandra Master; Sudipta K. Ray; William E. Sablinski; Thomas A. Wassick

Archive | 1981

High melting point copper-gold-tin brazing alloy for chip carriers

Norman G. Ainslie; Joseph Matthew Harvilchuck; Mario J. Interrante; William J. King; Paul Harry Palmateer; John Francis Sullivan

Archive | 1976

Selective reactive etching of metal or semiconductor - using plasma contg. chlorine, bromine or iodine (cpds.) avoids undercutting

Joseph Matthew Harvilchuck; Joseph Skinner Logan; William Clifford Metzger; Paul M. Schaible; Jacob Riseman; Geraldine Cogin Schwartz

Archive | 1989

Method and apparatus for causing an open circuit in a conductive line

Keith F. Beckham; David Carroll Challener; Arunava Gupta; Joseph Matthew Harvilchuck; James M. Leas; J. R. Lloyd; David C. Long; Horatio Quinones; Krishna Seshan; Morris Shatzkes

Archive | 1986

Process for forming a metallurgical system comprising a bottom layer of nickel and a top layer of gold

Avinash Sripad Adwalpalker; Joseph Matthew Harvilchuck; Joseph Rocco Ranalli; David W. Rich

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Joseph Louis Horvath

IBM

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Joseph Skinner Logan

IBM

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Mario J. Interrante

IBM

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Paul M. Schaible

IBM

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Robert G. Biskeborn

IBM

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William Clifford Metzger

IBM

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Geraldine Cogin Schwartz

IBM

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Jacob Riseman

IBM

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David W. Rich

IBM

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Edward Frank Handford

IBM

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