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Paul M. Schaible

IBM

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Publication

Featured researches published by Paul M. Schaible.

Archive | 1985

Chem-mech polishing method for producing coplanar metal/insulator films on a substrate

Klaus Dietrich Beyer; William L. Guthrie; Stanley R. Makarewicz; Eric Mendel; William John Patrick; Kathleen Alice Perry; William Aaron Pliskin; Jacob Riseman; Paul M. Schaible; Charles L. Standley

Archive | 1975

Reactive ion etching of aluminum

Joseph Matthew Harvilchuck; Joseph Skinner Logan; William Clifford Metzger; Paul M. Schaible

Archive | 1981

Method for forming planar metal/insulator structures

Valeria Platter; Laura Beth Rothman; Paul M. Schaible; Geraldine Cogin Schwartz

Archive | 1980

Dry etching of copper patterns

Paul M. Schaible; Geraldine Cogin Schwartz

Archive | 1977

Selective dry etching of substrates

Paul M. Schaible; Geraldine Cogin Schwartz; Laura B. Zielinski

Archive | 1982

Method for forming conductive lines and vias

Paul M. Schaible; John Suierveld

Archive | 1983

Method for forming conductive lines and via studs on LSI carrier substrates

Paul M. Schaible; John Suierveld

Archive | 1976

Selective reactive etching of metal or semiconductor - using plasma contg. chlorine, bromine or iodine (cpds.) avoids undercutting

Joseph Matthew Harvilchuck; Joseph Skinner Logan; William Clifford Metzger; Paul M. Schaible; Jacob Riseman; Geraldine Cogin Schwartz

Archive | 1982

Method for forming coplanar conductor/insulator films

Valeria Platter; Laura Beth Rothman; Paul M. Schaible; Geraldine Cogin Schwartz

Archive | 1981

METHOD FOR FORMING A COPPER BASED METAL PATTERN

Paul M. Schaible; Geraldine Cogin Schwartz

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Geraldine Cogin Schwartz

IBM

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Jacob Riseman

IBM

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Laura Beth Rothman

IBM

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Joseph Matthew Harvilchuck

IBM

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Joseph Skinner Logan

IBM

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William Clifford Metzger

IBM

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Valeria Platter

IBM

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Charles L. Standley

IBM

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Eric Mendel

IBM

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Kathleen Alice Perry

IBM

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