Joung-Sik Kim

Influence of Crystalline Si Solar Cell by Rie Surface Texturing

We fabricated a plasma texturing for multi-crystalline silicon cells using reactive ion etching (RIE). Multi-crystalline Si cells have not benefited from the cost-effective wet-chemical texturing processes that reduce front surface reflectance on single-crystal wafers. Elimination of plasma damage has been achieved while keeping front reflectance to extremely low levels. We will discuss reflectance, quantum efficiency and conversion efficiency for multi-crystalline Si solar cell by each RIE process conditions.

Study of Low Reflectance and RF Frequency by Rie Surface Texture Process in Multi Crystall Silicon Solar Cells

Conventional surface texturing in crystalline silicon solar cell have been use wet texturing by Alkali or Acid solution. But conventional wet texturing has the serious issue of wafer breakage by large consumption of wafer in wet solution and can not obtain the reflectance below 10% in multi crystalline silicon. Therefore it is focusing on RIE texturing, one method of dry etching. We developed large scale plasma RIE (Reactive Ion Etching) equipment which can accommodate 144 wafers (125 mm) in tray in order to provide surface texturing on the silicon wafer surface. Reflectance was controllable from 3% to 20% in crystalline silicon depending on the texture shape and height. We have achieved excellent reflectance below 4% on the weighted average (300~1,100 nm) in multi crystalline silicon using plasma texturing with gas mixture ratio such as , , and . The texture shape and height on the silicon wafer surface have an effect on gas chemistry, etching time, RF frequency, and so on. Excellent conversion efficiency of 16.1% is obtained in multi crystalline silicon by RIE process. In order to know the influence of RF frequency with 2 MHz and 13.56 MHz, texturing shape and conversion efficiency are compared and discussed mutually using RIE technology.

Incident Angle Dependence of Quantum Efficiency in c-Si Solar Cell or a-Si Thin Film Solar Cell in BIPV System

The conversion efficiency of solar cells depending on incident angle of light is important for building-integrated photovoltaics (BIPV) applications. The quantum efficiency is the ratio of the number of charge carriers collected by the solar cell to the number of photons of a given energy shining on the solar cell. The analysis of angle dependence of quantum efficiencies give more information upon the variation of power output of a solar cell by the incident angle of light. The variations in power output of solar cells with increasing angle of incidence is different for the type of cell structures. In this study we present the results of the quantum efficiency measurement of single-crystalline silicon solar cells and a-Si:H thin-film solar cells with the angle of incidence of light. As a result, as the angle of incidence increases in single-crystalline silicon solar cells, quantum efficiency at all wavelength (300~1,100 nm) of light were reduced. But in case of a-Si:H thin-film solar cells, quantum efficiency was increased or maintained at the angle of incidence from 0 degree to about 40 degrees and dramatically decrease at more than 40 degrees in the range of visible light. This results of quantum efficiency with increasing incident angle were caused by haze and interference effects in thin-film structure. Thus, the structural optimization considering incident angle dependence of solar cells is expected to benefit BIPV.건재 일체형 태양광발전(BIPV) 응용을 위해 광 입사각에 따른 태양전지의 변환 효율은 중요하다. 양자효율은 태양전지의 파장별 전자 수집효율을 말하며, 입사각별 양자효율 측정으로 입사각에 따른 태양전지 출력 변화 요인을 분석할 수 있다. 이러한 입사각별 양자효율은 태양전지 종류에 따라 차이를 보인다. 본 연구에서는 가장 많이 쓰이는 벌크형 단결정 실리콘 태양전지와 박막형 비정질 실리콘 태양전지의 입사각별 양자효율을 비교하였다. 그 결과, 단결정 실리콘 태양전지에서는 광 입사각이 증가함에 따라 전 파장영역에서 양자효율이 감소했다. 반면, 비정질 박막 실리콘 태양전지에서는 단파장 영역에서는 결정질 실리콘과 동일하게 감소하였으나, 그 이후의 흡수 영역에서 약 40o의 입사각까지 증가 또는 일정한 양자효율을 보이다가 이후에 급격히 감소하는 결과를 얻었다. 이는 비정질 박막 실리콘 태양전지에서 입사각이 증가함에 따라 특정 파장 영역에서 산란과 박막 구조의 영향으로 예상된다. 따라서, 태양전지의 구조 및 광학 구조 최적화 등으로 BIPV 적용에 유리한 구조 태양전지 제작이 가능할 것으로 보인다.

New plasma source development using a parallel resonance antenna for dry etching

Summary form only given, as follows. In sub-0.1 /spl mu/m scale device, the achievement of a uniform high-density, low pressure plasma source with a large area is major concern. Particularly, in the ultralarge scale integrated-circuit etching process, the development of dry etcher to handle larger area wafers is urgently required as the current 200 mm wafer diameter moves to 300 mm under situation of low electron temperature, uniform high-density plasma over large area, high-etch selectivity, no charge damage, etc. In this study, we have developed the new plasma source of VHF-ICP with a parallel resonance antenna for dry etcher.