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Dive into the research topics where Juergen Dr Ing Wilde is active.

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Featured researches published by Juergen Dr Ing Wilde.


Thin Solid Films | 1998

Moisture-resistant properties of SiNx films prepared by PECVD

Hui Lin; Liqiang Xu; Xiang Chen; Xuhong Wang; Mei Sheng; Frank Stubhan; Karl-Heinz Merkel; Juergen Dr Ing Wilde

The barrier properties of silicon nitride films prepared by plasma-enhanced chemical vapor deposition (PECVD) against moisture penetration were studied, with emphasis on the correlation of deposition parameters and moisture permeation rate. The moisture resistance of films have been characterized using infrared spectroscopy and determination of water vapor permeation (WVP) rate. Our results indicate that the gas flux ratio and discharge frequency are the most important factors in controlling the moisture resistance of these films. The best moisture-resistant property in terms of WVP and stability of the film is found in the film deposited in a low frequency (LF) process with lower ratio of silane to ammonia although the general trend is toward decreased WVP with a higher ratio of silane to ammonia in the films deposited freshly by both high and low frequency processes. Too high a ratio of silane to ammonia in LF processes leads to instability of the film after long exposure in a high humidity environment.


Focus on Surfactants | 1999

An integrated design approach for the hardware optimization of electrical power modules for automotive electrotraction

Juergen Dr Ing Wilde; Wolfgang Staiger; Markus Thoben

In this paper, a systematic approach is presented for the design and optimization of forced liquid cooled electronic modules with high power dissipation. The steps of the design cycle include hydrodynamical evaluation of the heat sink, thermal management, thermomechanical optimization and especially lifetime prediction of soldered joints. Utilized engineering tools comprise computational fluid dynamics, finite differences and finite element programs. These are coupled via software interfaces in order to enable data exchange as well as efficient cooperation of the designers. Applying these means, performance, reliability and costs of a certain module have been optimized. By use of a design-for-reliability procedure substantial savings with regard to development time, prototyping effort and consequently costs can been achieved.


Archive | 1995

Diffusion soldering method esp. for semiconductor components

Juergen Dr Ing Wilde; Rainer Prof Dr I Schmid-Fetzer


Archive | 1995

Diffusion soldering of a multi-layered structure

Juergen Dr Ing Wilde; Rainer Prof Dr I Schmid-Fetzer


Archive | 1995

Apparatus for diffusion soldering

Juergen Dr Ing Wilde; Rainer Prof Dr I Schmid-Fetzer


Archive | 1993

Method for producing a positively engaging connection between semiconductor components and metallic surface of carrier elements

Juergen Dr Ing Wilde


Thin Solid Films | 1998

Moisture-resistant properties of SiN x films prepared by PECVD

Hui Lin; Liqiang Xu; Xiang Ming Chen; Xuhong Wang; Mei Sheng; Frank Stubhan; Karl-Heinz Merkel; Juergen Dr Ing Wilde


SAE transactions | 1998

Integration of Liquid Cooling, Thermal and Thermomechanical Design for the Lifetime Prediction of Electrical Power Modules

Juergen Dr Ing Wilde; Wolfgang Staiger; Markus Thoben; Bernhard Schuch; Herrmann Kilian


Archive | 1997

Bauelement mit Schutzschicht und Verfahren zur Herstellung des Bauelements

Frank Stubhan; Juergen Dr Ing Wilde; Gabriele Staudigl


Archive | 2000

COMPONENT WITH PROTECTIVE LAYER AND METHOD FOR PRODUCING A PROTECTIVE LAYER FOR A COMPONENT

Frank Stubhan; Juergen Dr Ing Wilde; Gabriele Staudigl

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