Jun Eon Jin

Low-frequency noise in multilayer MoS2 field-effect transistors: the effect of high-k passivation

Diagnosing of the interface quality and the interactions between insulators and semiconductors is significant to achieve the high performance of nanodevices. Herein, low-frequency noise (LFN) in mechanically exfoliated multilayer molybdenum disulfide (MoS2) (~11.3 nm-thick) field-effect transistors with back-gate control was characterized with and without an Al2O3 high-k passivation layer. The carrier number fluctuation (CNF) model associated with trapping/detrapping the charge carriers at the interface nicely described the noise behavior in the strong accumulation regime both with and without the Al2O3 passivation layer. The interface trap density at the MoS2-SiO2 interface was extracted from the LFN analysis, and estimated to be Nit ~ 10(10) eV(-1) cm(-2) without and with the passivation layer. This suggested that the accumulation channel induced by the back-gate was not significantly influenced by the passivation layer. The Hooge mobility fluctuation (HMF) model implying the bulk conduction was found to describe the drain current fluctuations in the subthreshold regime, which is rarely observed in other nanodevices, attributed to those extremely thin channel sizes. In the case of the thick-MoS2 (~40 nm-thick) without the passivation, the HMF model was clearly observed all over the operation regime, ensuring the existence of the bulk conduction in multilayer MoS2. With the Al2O3 passivation layer, the change in the noise behavior was explained from the point of formation of the additional top channel in the MoS2 because of the fixed charges in the Al2O3. The interface trap density from the additional CNF model was Nit = 1.8 × 10(12) eV(-1) cm(-2) at the MoS2-Al2O3 interface.

Electrical conductivity enhancement of metallic single-walled carbon nanotube networks by CoO decoration

We report that the decoration of metallic single-walled carbon nanotube (m-SWCNT) networks with cobalt(ii) oxide (CoO) can improve the electrical conductivity of the networks. To measure the electrical conductivity, we prepared m-SWCNT networks between the source and drain electrodes of field-effect transistors (FETs). Then, the amount of CoO nanoparticles (NPs) used for decoration was controlled by treating the FETs with different volumes of a solution containing Co(NO3)2·6H2O. Atomic force microscopy imaging showed that CoO NPs were intensively deposited on the intertubular junction of the m-SWCNT networks. X-ray photoelectron spectroscopy confirmed that the oxidation state of the Co element on m-SWCNT was CoO. Raman spectra revealed that heavy decoration of CoO increased the D-band intensity of the m-SWCNT, indicating that the CoO NPs disordered the sp(2) hybridized carbon atoms of the m-SWCNT via decoration. The electrical conductivity of the m-SWCNT networks was enhanced up to 28 times after decoration, and this was attributed to the CoO NPs connecting the m-SWCNTs at junctions of the networks.

Current fluctuation of electron and hole carriers in multilayer WSe2 field effect transistors

Two-dimensional materials have outstanding scalability due to their structural and electrical properties for the logic devices. Here, we report the current fluctuation in multilayer WSe2 field effect transistors (FETs). In order to demonstrate the impact on carrier types, n-type and p-type WSe2 FETs are fabricated with different work function metals. Each device has similar electrical characteristics except for the threshold voltage. In the low frequency noise analysis, drain current power spectral density (SI) is inversely proportional to frequency, indicating typical 1/f noise behaviors. The curves of the normalized drain current power spectral density (NSI) as a function of drain current at the 10 Hz of frequency indicate that our devices follow the carrier number fluctuation with correlated mobility fluctuation model. This means that current fluctuation depends on the trapping-detrapping motion of the charge carriers near the channel interface. No significant difference is observed in the current fluc...

Graphene arch gate SiO2 shell silicon nanowire core field effect transistors

We report the realization of graphene arch gate silicon nanowire field effect transistors with SiO2 shell serving as a gate insulator. The arch coverage of the SiO2 shell was achieved by the flexible graphene layers complying the top of the shell. The wrapping angle was defined by the relative strength of the van der Waals forces on the shell and the substrate. The leakage current of the graphene gate was only 55 fA, while the maximum on-off ratio of 16.7 was obtained. The effective mobility and quantum capacitance of the graphene layers were also obtained from the electronic transport data.

Ambipolar behavior in MoS2 field effect transistors by using catalytic oxidation

Modulation of electrical properties in MoS2 flakes is an attractive issue from the point of view of device applications. In this work, we demonstrate that an ambipolar behavior in MoS2 field effect transistors (FETs) can be easily obtained by heating MoS2 flakes under air atmosphere in the presence of cobalt oxide catalyst (MoS2 + O2 → MoOx + SOx). The catalytic oxidation of MoS2 flakes between source-drain electrodes resulted in lots of MoOx nanoparticles (NPs) on MoS2 flakes with thickness reduction from 64 nm to 17 nm. Consequently, N-type behavior of MoS2 FETs was converted into ambipolar transport characteristics by MoOx NPs which inject hole carriers to MoS2 flakes.

Surface Modulation of Graphene Field Effect Transistors on Periodic Trench Structure

In this work, graphene field effect transistors (FETs) were fabricated on a trench structure made by carbonized poly(methylmethacrylate) to modify the graphene surface. The trench-structured devices showed different characteristics depending on the channel orientation and the pitch size of the trenches as well as channel area in the FETs. Periodic corrugations and barriers of suspended graphene on the trench structure were measured by atomic force microscopy and electrostatic force microscopy. Regular barriers of 160 mV were observed for the trench structure with graphene. To confirm the transfer mechanism in the FETs depending on the channel orientation, the ratio of experimental mobility (3.6-3.74) was extracted from the current-voltage characteristics using equivalent circuit simulation. It is shown that the number of barriers increases as the pitch size decreases because the number of corrugations increases from different trench pitches. The noise for the 140 nm pitch trench is 1 order of magnitude higher than that for the 200 nm pitch trench.

Capacitance-voltage analysis of electrical properties for WSe2 field effect transistors with high-k encapsulation layer

Doping effects in devices based on two-dimensional (2D) materials have been widely studied. However, detailed analysis and the mechanism of the doping effect caused by encapsulation layers has not been sufficiently explored. In this work, we present experimental studies on the n-doping effect in WSe2 field effect transistors (FETs) with a high-k encapsulation layer (Al2O3) grown by atomic layer deposition. In addition, we demonstrate the mechanism and origin of the doping effect. After encapsulation of the Al2O3 layer, the threshold voltage of the WSe2 FET negatively shifted with the increase of the on-current. The capacitance-voltage measurements of the metal insulator semiconductor (MIS) structure proved the presence of the positive fixed charges within the Al2O3 layer. The flat-band voltage of the MIS structure of Au/Al2O3/SiO2/Si was shifted toward the negative direction on account of the positive fixed charges in the Al2O3 layer. Our results clearly revealed that the fixed charges in the Al2O3 encapsulation layer modulated the Fermi energy level via the field effect. Moreover, these results possibly provide fundamental ideas and guidelines to design 2D materials FETs with high-performance and reliability.

Low frequency noise reduction in multilayer WSe2 field effect transistors

We report that noise level was reduced by passivating WSe2 field effect transistors (FETs) with high-k dielectric material. Low frequency noise and I-V characteristics of the device were measured from WSe2 FETs before and after the passivation with ZrO2 to confirm the effect of passivation by high-k dielectric material. As a result, there was no significant change in the I-V characteristics. In the low frequency noise analysis, our device showed 1/f noise behaviors, in agreement with the carrier number fluctuation (CNF) model. The passivation process contributed to the reduction of trap sites at the top surface, leading to the decrease of noise level at the low current regime. Extracted volume trap densities were reduced from 2.0 × 1020 cm-3eV-1 to 8.7 × 1019 cm-3eV-1.

Inductively coupled plasma etching of hafnium–indium–zinc oxide using chlorine based gas mixtures

Summary form only given. Amorphous Hafnium-Indium-Zinc Oxide(a-HIZO) semiconductor materials are used to replace amorphous Gallium-Indium-Zinc Oxide(a-GIZO) as channel layer of thin film transistors (TFTs) to improve the stability of the electrical characteristics. However, research activities of a-HIZO etching process for the fabrication of TFTs have not been reported. In this work, we present the etching characteristics of HIZO stacked with photoresist using Cl2/Ar chemistry. Etching behaviours of HIZO have been investigated as a function of source power, bias power and pressure. As the Cl2 concentration increased from pure Ar, the etch rate of HIZO film was slightly different from the trend of GIZO film. Atomic Force Microscopy(AFM), Depth profile of the HIZO film by Auger Electronspectroscopy(AES) and X-ray Photoelectron Spectroscopy(XPS) of the etched surface was carried to investigate the etching mechanism as Cl2 increased. Additionally we tried to compare the etching mechanism of HIZO film with GIZO film to confirm the difference of chemical bonds caused by the influence of hafnium doping, estimated that the low chemical reaction between hafnium and Cl2 based plasma suppress the reactive ion etching.