Jung-Yeul Yun

Solution processed aluminum paper for flexible electronics.

As an alternative to vacuum deposition, preparation of highly conductive papers with aluminum (Al) features is successfully achieved by the solution process consisting of Al precursor ink (AlH(3){O(C(4)H(9))(2)}) and low temperature stamping process performed at 110 °C without any serious hydroxylation and oxidation problems. Al features formed on several kinds of paper substrates (calendar, magazine, and inkjet printing paper substrates) are less than ~60 nm thick, and their electrical conductivities were found to be as good as thermally evaporated Al film or even better (≤2 Ω/□). Strong adhesion of Al features to paper substrates and their excellent flexibility are also experimentally confirmed by TEM observation and mechanical tests, such as tape and bending tests. The solution processed Al features on paper substrates show different electrical and mechanical performance depending on the paper type, and inkjet printing paper is found to be the best substrate with high and stable electrical and mechanical properties. The Al conductive papers produced by the solution process may be applicable in disposal paper electronics.

A novel solution-stamping process for preparation of a highly conductive aluminum thin film.

A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.

High Temperature Oxidation Behavior of Ni based Porous Metal

【This study investigated the high temperature oxidation behavior of Ni-22.4%Fe-22%Cr-6%Al (wt.%) porous metal. Two types of open porous metals with different pore sizes of 30 PPI and 40 PPI (pore per inch) were used. A 24-hour TGA test was conducted at three different temperatures of

The effect of loading on sintering and catalytic activity of Pt/SiO2 hybrid catalyst powders synthesized via spray pyrolysis

900^{\circ}C

The Effect of Binder Content for the Pore Properties of Fe Foam Fabricated by Slurry Coating Process

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High-Temperature Oxidation Behavior of Fe-22%Cr-5.8%Al Alloy

1000^{\circ}C

Fabrication of Fecralloy Foil Coated by Fecralloy Nanoparticles Using Electrospray Processing

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Direct synthesis of zirconium powder by magnesium reduction

1100^{\circ}C

Fabrication of Ni-free Fe-based Alloy Nano Powder by Pulsed Wire Evaporation in Liquid: Part 2. Effect of Solvent and Comparison of Fabricated Powder owing to Fabrication Method

. The results of the BET analysis revealed that the specific surface area increased as the pore size decreased from 30 PPI to 40 PPI. The oxidation resistance of porous metal decreased with decreasing pore size. As the temperature increased, the oxidation weight gain of the porous metal also increased. Porous metals mainly created oxides such as

Fabrication of Ni-free Fe-based Alloy Nano Powder by Pulsed Wire Evaporation in Liquid: Part I. Effect of Wire Diameter and Applied Voltage

Al_2O_3