Junichi Asada

Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same

Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member

Semiconductor device, lead frame and method for manufacturing semiconductor devices

Process for encapsulating a semiconductor device and lead frame

Semiconductor device of surface mounting type and method for fabricating the same

Lead frame for semiconductor device that prevents island torsion

SEMICONDUCTOR STORAGE DEVICE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR STORAGE DEVICE

Operation assuring structure of electronic circuit board in connector for said circuit board

Semiconductor device utilizing a lead on chip structure

USB MEMORY DEVICE